ZHCSHK8E october   2017  – july 2023 TAS2770

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 TDM Port Timing Requirements
    8. 6.8 PDM Port Timing Requirements
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Mode and Address Selection
      2. 8.3.2 General I2C Operation
      3. 8.3.3 Single-Byte and Multiple-Byte Transfers
      4. 8.3.4 Single-Byte Write
      5. 8.3.5 Multiple-Byte Write and Incremental Multiple-Byte Write
      6. 8.3.6 Single-Byte Read
      7. 8.3.7 Multiple-Byte Read
      8. 8.3.8 Register Organization
    4. 8.4 Device Functional Modes
      1. 8.4.1  PDM Input
      2. 8.4.2  TDM Port
      3. 8.4.3  Playback Signal Path
        1. 8.4.3.1 High Pass Filter
        2. 8.4.3.2 Digital Volume Control and Amplifier Output Level
        3. 8.4.3.3 Audio Playback Selection
        4. 8.4.3.4 Battery Tracking Limiter with Brown Out Prevention
        5. 8.4.3.5 Inter Chip Limiter Alignment
          1. 8.4.3.5.1 TDM Mode
        6. 8.4.3.6 Class-D Settings
      4. 8.4.4  SAR ADC
      5. 8.4.5  IV Sense
      6. 8.4.6  Clocks and PLL
      7. 8.4.7  Operational Modes
        1. 8.4.7.1 Hardware Shutdown
        2. 8.4.7.2 Software Shutdown
        3. 8.4.7.3 Mute
        4. 8.4.7.4 Active
        5. 8.4.7.5 Mode Control and Software Reset
      8. 8.4.8  Faults and Status
      9. 8.4.9  Power Sequencing Requirements
      10. 8.4.10 Digital Input Pull Downs
    5. 8.5 Register Maps
      1. 8.5.1 Register Summary Table Book=0x00 Page=0x00
      2. 8.5.2 Register Maps
        1. 8.5.2.1  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
        2. 8.5.2.2  SW_RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
        3. 8.5.2.3  PWR_CTL (book=0x00 page=0x00 address=0x02) [reset=Eh]
        4. 8.5.2.4  PB_CFG0 (book=0x00 page=0x00 address=0x03) [reset=10h]
        5. 8.5.2.5  PB_CFG1 (book=0x00 page=0x00 address=0x04) [reset=1h]
        6. 8.5.2.6  PB_CFG2 (book=0x00 page=0x00 address=0x05) [reset=0h]
        7. 8.5.2.7  PB_CFG3 (book=0x00 page=0x00 address=0x06) [reset=0h]
        8. 8.5.2.8  MISC_CFG (book=0x00 page=0x00 address=0x07) [reset=6h]
        9. 8.5.2.9  PDM_CFG0 (book=0x00 page=0x00 address=0x08) [reset=0h]
        10. 8.5.2.10 PDM_CFG1 (book=0x00 page=0x00 address=0x09) [reset=8h]
        11. 8.5.2.11 TDM_CFG0 (book=0x00 page=0x00 address=0x0A) [reset=7h]
        12. 8.5.2.12 TDM_CFG1 (book=0x00 page=0x00 address=0x0B) [reset=2h]
        13. 8.5.2.13 TDM_CFG2 (book=0x00 page=0x00 address=0x0C) [reset=Ah]
        14. 8.5.2.14 TDM_CFG3 (book=0x00 page=0x00 address=0x0D) [reset=10h]
        15. 8.5.2.15 TDM_CFG4 (book=0x00 page=0x00 address=0x0E) [reset=13h]
        16. 8.5.2.16 TDM_CFG5 (book=0x00 page=0x00 address=0x0F) [reset=2h]
        17. 8.5.2.17 TDM_CFG6 (book=0x00 page=0x00 address=0x10) [reset=0h]
        18. 8.5.2.18 TDM_CFG7 (book=0x00 page=0x00 address=0x11) [reset=4h]
        19. 8.5.2.19 TDM_CFG8 (book=0x00 page=0x00 address=0x12) [reset=6h]
        20. 8.5.2.20 TDM_CFG9 (book=0x00 page=0x00 address=0x13) [reset=7h]
        21. 8.5.2.21 TDM_CFG10 (book=0x00 page=0x00 address=0x14) [reset=8h]
        22. 8.5.2.22 LIM_CFG0 (book=0x00 page=0x00 address=0x15) [reset=14h]
        23. 8.5.2.23 LIM_CFG1 (book=0x00 page=0x00 address=0x16) [reset=76h]
        24. 8.5.2.24 LIM_CFG2 (book=0x00 page=0x00 address=0x17) [reset=10h]
        25. 8.5.2.25 LIM_CFG3 (book=0x00 page=0x00 address=0x18) [reset=6Eh]
        26. 8.5.2.26 LIM_CFG4 (book=0x00 page=0x00 address=0x19) [reset=1Eh]
        27. 8.5.2.27 LIM_CFG5 (book=0x00 page=0x00 address=0x1A) [reset=58h]
        28. 8.5.2.28 BOP_CFG0 (book=0x00 page=0x00 address=0x1B) [reset=1h]
        29. 8.5.2.29 BOP_CFG1 (book=0x00 page=0x00 address=0x1C) [reset=14h]
        30. 8.5.2.30 BOP_CFG2 (book=0x00 page=0x00 address=0x1D) [reset=4Eh]
        31. 8.5.2.31 ICLA_CFG0 (book=0x00 page=0x00 address=0x1E) [reset=0h]
        32. 8.5.2.32 ICLA_CFG1 (book=0x00 page=0x00 address=0x1F) [reset=0h]
        33. 8.5.2.33 INT_MASK0 (book=0x00 page=0x00 address=0x20) [reset=FCh]
        34. 8.5.2.34 INT_MASK1 (book=0x00 page=0x00 address=0x21) [reset=B1h]
        35. 8.5.2.35 INT_LIVE0 (book=0x00 page=0x00 address=0x22) [reset=0h]
        36. 8.5.2.36 INT_LIVE1 (book=0x00 page=0x00 address=0x23) [reset=0h]
        37. 8.5.2.37 INT_LTCH0 (book=0x00 page=0x00 address=0x24) [reset=0h]
        38. 8.5.2.38 INT_LTCH1 (book=0x00 page=0x00 address=0x25) [reset=0h]
        39. 8.5.2.39 INT_LTCH2 (book=0x00 page=0x00 address=0x26) [reset=0h]
        40. 8.5.2.40 VBAT_MSB (book=0x00 page=0x00 address=0x27) [reset=0h]
        41. 8.5.2.41 VBAT_LSB (book=0x00 page=0x00 address=0x28) [reset=0h]
        42. 8.5.2.42 TEMP_MSB (book=0x00 page=0x00 address=0x29) [reset=0h]
        43. 8.5.2.43 TEMP_LSB (book=0x00 page=0x00 address=0x2A) [reset=0h]
        44. 8.5.2.44 INT_CFG (book=0x00 page=0x00 address=0x30) [reset=5h]
        45. 8.5.2.45 DIN_PD (book=0x00 page=0x00 address=0x31) [reset=0h]
        46. 8.5.2.46 MISC_IRQ (book=0x00 page=0x00 address=0x32) [reset=81h]
        47. 8.5.2.47 CLOCK_CFG (book=0x00 page=0x00 address=0x3C) [reset=Dh]
        48. 8.5.2.48 TDM_DET (book=0x00 page=0x00 address=0x77) [reset=7Fh]
        49. 8.5.2.49 REV_ID (book=0x00 page=0x00 address=0x7D) [reset=20h]
        50. 8.5.2.50 I2C_CKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
        51. 8.5.2.51 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Overview
        2. 9.2.2.2 Select Input Capacitance
        3. 9.2.2.3 Select Decoupling Capacitors
        4. 9.2.2.4 Select Bootstrap Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Set Up
      1. 9.3.1 Initial Device Configuration - Auto Rate
      2. 9.3.2 Initial Device Configuration - 48 kHz
      3. 9.3.3 Initial Device Configuration - 44.1 kHz
      4. 9.3.4 Sample Rate Change - 48 kHz to 44.1kHz
      5. 9.3.5 Sample Rate Change - 44.1 kHz to 48 kHz
      6. 9.3.6 Device Mute
      7. 9.3.7 Device Un-Mute
      8. 9.3.8 Device Sleep
      9. 9.3.9 Device Wake
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

TAS2770 是一款经优化后可高效驱动小型扬声器的单声道数字输入 D 类音频放大器。凭借出色的输出功率、保护功能和封装，TAS2770 成为智能扬声器、蓝牙扬声器、家庭自动化设备、笔记本电脑和平板电脑的理想选择。

该 D 类放大器能够在 16V 电压下向 4Ω 的负载提供 20W 的连续功率，在 16V 电压下向 8Ω 的负载提供 15W 的连续功率，两种情况下的 THD 都为 1%。4.5V 至 16V 的宽输入电压范围和高输出功率使该放大器具有出色的通用性，能够与电池电源或线路供电系统配合使用。

欠压保护器跟踪峰值电压，并自动将增益限制为可用电压。该硬件实现的功能降低了放大器对系统电源的需求，从而防止音频中断和系统关断。

TAS2770 可用作常规放大器或与基于主机的扬声器保护算法配合使用。集成的扬声器电压和电流感应功能可通过 I2S 返回路径将扬声器状况实时反馈到保护算法。

最多有 8 个器件可以通过任意一个 I2S/TDM + I2C 共享一个公共总线。

TAS2770 器件采用 26 引脚、0.4mm 间距 QFN 封装，实现紧凑的 PCB 空间。

器件信息
器件型号封装封装尺寸（标称值）
TAS2770QFN4mm × 3.5mm
TAS2770DSBGA2mm × 2.52mm
SNP002770QFN4mm x 3.5mm
SNP002770DSBGA2mm × 2.52mm
TAS5770LC0 DSBGA 2mm × 2.52mm
GUID-EAC02902-9769-48D5-9014-C34857FD8B39-low.gif 功能方框图
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