ZHCSEH3B December   2015  – September 2018 TAS5411-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化框图
      2.      效率
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements for I2C Interface Signals
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Audio Input and Preamplifier
      2. 9.3.2 Pulse-Width Modulator (PWM)
      3. 9.3.3 Gate Drive
      4. 9.3.4 Power FETs
      5. 9.3.5 Load Diagnostics
        1. 9.3.5.1 Load Diagnostics Sequence
        2. 9.3.5.2 Faults During Load Diagnostics
      6. 9.3.6 Protection and Monitoring
      7. 9.3.7 I2C Serial Communication Bus
        1. 9.3.7.1 I2C Bus Protocol
        2. 9.3.7.2 Random Write
        3. 9.3.7.3 Random Read
        4. 9.3.7.4 Sequential Read
    4. 9.4 Device Functional Modes
      1. 9.4.1 Hardware Control Pins
      2. 9.4.2 EMI Considerations
      3. 9.4.3 Operating Modes and Faults
    5. 9.5 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Amplifier Output Filtering
        2. 10.2.1.2 Amplifier Output Snubbers
        3. 10.2.1.3 Bootstrap Capacitors
        4. 10.2.1.4 Analog Audio Input Filter
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Unused Pin Connections
          1. 10.2.2.1.1 MUTE Pin
          2. 10.2.2.1.2 STANDBY Pin
          3. 10.2.2.1.3 I2C Pins (SDA and SCL)
          4. 10.2.2.1.4 Terminating Unused Outputs
          5. 10.2.2.1.5 Using a Single-Ended Audio Input
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 Top Layer
      2. 12.2.2 Second Layer – Signal Layer
      3. 12.2.3 Third Layer – Power Layer
      4. 12.2.4 Bottom Layer – Ground Layer
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Protection and Monitoring

  • Overcurrent Shutdown (OCSD)—The overcurrent shutdown forces the output into Hi-Z. The device asserts the FAULT pin and updates the I2C register.
  • DC Detect—This circuit checks for a dc offset continuously during normal operation at the output of the amplifier. If a dc offset occurs, the device asserts the FAULT pin and updates the I2C register. Note that the dc detection threshold follows PVDD changes.
  • Overtemperature Shutdown (OTSD)—The device shuts down when the die junction temperature reaches the overtemperature threshold. The device asserts the FAULT pin and updates I2C register. Recovery is automatic when the temperature returns to a safe level.
  • Undervoltage (UV)—The undervoltage (UV) protection detects low voltages on PVDD. In the event of an undervoltage condition, the device asserts the FAULT pin and resets the I2C register.
  • Power-On Reset (POR)—Power-on reset (POR) occurs when PVDD drops below the POR threshold. A POR event causes the I2C bus to go into a high-impedance state. After recovery from the POR event, the device restarts automatically with default I2C register settings. The I2C is active as long as the device is not in POR.
  • Overvoltage (OV) and Load Dump—OV protection detects high voltages on PVDD. If PVDD reaches the overvoltage threshold, the device asserts the FAULT pin and updates the I2C register. The device can withstand 40-V load-dump voltage spikes.
  • SpeakerGuard™ Protection Circuitry—This protection circuitry limits the output voltage to the value selected in I2C register 0x03. This value determines both the positive and negative limits. One can use this feature to improve battery life or protect the speaker from exceeding its excursion limits.
  • Adjacent-Pin Shorts—The device design is such that shorts between adjacent pins do not cause damage.