10.2.2 Detailed Design Procedure

Use the following steps for the design procedure:

1. Hardware Schematic Design: Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
2. Following the recommended layout guidelines, integrate the device and its supporting components into the system PCB file.
3. Thermal Design: The device has an exposed thermal pad which requires proper soldering. For more information, see the Semiconductor and IC Package Thermal Metrics, SPRA953, and the PowerPAD Thermally Enhanced Package, SLMA002G, application reports.
4. Develop software: The EVM User's Guide, SLOU431, has detailed instructions for how to set up the device, interpret diagnostic information, and so forth. For information about control registers, see the Register Maps section.