ZHCSL71A April   2020  – July 2020 TAS5431-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Audio Input and Preamplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Gate Drive
      4. 7.3.4 Power FETs
      5. 7.3.5 Load Diagnostics
        1. 7.3.5.1 Load Diagnostics Sequence
        2. 7.3.5.2 Faults During Load Diagnostics
      6. 7.3.6 Protection and Monitoring
      7. 7.3.7 I2C Serial Communication Bus
        1. 7.3.7.1 I2C Bus Protocol
        2. 7.3.7.2 Random Write
        3. 7.3.7.3 Random Read
        4. 7.3.7.4 Sequential Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Hardware Control Pins
      2. 7.4.2 EMI Considerations
      3. 7.4.3 Operating Modes and Faults
    5. 7.5 Register Maps
      1. 7.5.1 I2C Address Register Definitions
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Amplifier Output Filtering
        2. 8.2.1.2 Amplifier Output Snubbers
        3. 8.2.1.3 Bootstrap Capacitors
        4. 8.2.1.4 Analog Audio Input Filter
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Unused Pin Connections
          1. 8.2.2.1.1 MUTE Pin
          2. 8.2.2.1.2 STANDBY Pin
          3. 8.2.2.1.3 I2C Pins (SDA and SCL)
          4. 8.2.2.1.4 Terminating Unused Outputs
          5. 8.2.2.1.5 Using a Single-Ended Audio Input
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Top Layer
      2. 10.2.2 Second Layer – Signal Layer
      3. 10.2.3 Third Layer – Power Layer
      4. 10.2.4 Bottom Layer – Ground Layer
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 符合汽车应用要求的 AEC-Q100 标准
    • 温度等级 1: – 40 ° C 至 125 ° C 、 T A
  • 单声道 BTL 数字功率放大器
  • 8负载为 4Ω 且 THD+N 为 10% 时的输出功率为 W
  • 4.5V 至 18V 运行电压范围
  • 负载为 4Ω 时的效率为 83%
  • 差分模拟输入
  • 采用可调功率限制器的 Speaker Guard™ 扬声器保护
  • 75dB 电源抑制比 (PSRR)
  • 负载诊断功能:
    • 开路和短路输出负载
    • 输出到电源和输出到接地短接
  • 保护和监控功能:
    • 短路保护
    • 40V 负载突降保护符合 ISO-7637-2 标准
    • 在音乐播放的同时进行输出直流电平检测
    • 过热保护
    • 欠压和过压保护
  • 采用 PowerPAD™ 封装(焊盘朝下)的耐热增强型 16 引脚 HTSSOP (PWP) 封装
  • 旨在满足汽车电磁兼容性 (EMC) 要求
  • ISO9000:已通过 2002 TS16949 认证
  • 待机时 40V 负载突降保护
  • 待机时无阻塞 I2C