The TAS5558 uses the PCB as a heat sink; therefore, the PowerPAD must be soldered to the PCB, and adequate copper areas and copper vias connecting the top, bottom, and internal layers should be used.
Decoupling capacitors should be placed as close to the DVDD1_CORE, DVDD2_CORE, VR_DIG, AVDD_PWM and AVDD as possible. These decoupling capacitors should also have a path through the GND plane back to the power pad, as shown by the blue area in the layout example in Figure 53.
A single common GND plane between AGND and DGND is recommended to avoid a potential voltage difference between them. Multiple vias from the TAS5558 PowerPAD should be connected to GND with a large copper pad as well as vias to all GND planes.
Further guidelines can be found on the layout example in Figure 53.
A more detailed example of the PCB layout can be found in the TAS5548EVM User's Guide (SLOU351).