11.1.3.2 Stencil Pattern

The recommended drawings for the TAS5760M device PCB footprint and associated stencil pattern are shown at the end of this document in the package addendum. Additionally, baseline recommendations for the via arrangement under and around the device are given as a starting point for the PCB design. This guidance is provided to suit the majority of manufacturing capabilities in the industry and prioritizes manufacturability over all other performance criteria. In elevated ambient temperatures or under high-power dissipation use-cases, this guidance may be too conservative and advanced PCB design techniques may be used to improve thermal performance of the system. It is important to note that the customer must verify that deviation from the guidance shown in the package addendum, including the deviation explained in this section, meets the customer’s quality, reliability, and manufacturability goals.