ZHCSBC3F July   2013  – February 2020 TAS5760M

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      功能方框图
      2.      10% THD+N 时的功率与 PVDD 间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Digital I/O Pins
    5. 6.5  Master Clock
    6. 6.6  Serial Audio Port
    7. 6.7  Protection Circuitry
    8. 6.8  Speaker Amplifier in All Modes
    9. 6.9  Speaker Amplifier in Stereo Bridge Tied Load (BTL) Mode
    10. 6.10 Speaker Amplifier in Mono Parallel Bridge Tied Load (PBTL) Mode
    11. 6.11 I²C Control Port
    12. 6.12 Typical Idle, Mute, Shutdown, Operational Power Consumption
    13. 6.13 Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 384 kHz
    14. 6.14 Typical Characteristics (Stereo BTL Mode): fSPK_AMP = 768 kHz
    15. 6.15 Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 384 kHz
    16. 6.16 Typical Characteristics (Mono PBTL Mode): fSPK_AMP = 768 kHz
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supplies
      2. 8.3.2 Speaker Amplifier Audio Signal Path
        1. 8.3.2.1 Serial Audio Port (SAP)
          1. 8.3.2.1.1 I²S Timing
          2. 8.3.2.1.2 Left-Justified
          3. 8.3.2.1.3 Right-Justified
        2. 8.3.2.2 DC Blocking Filter
        3. 8.3.2.3 Digital Boost and Volume Control
        4. 8.3.2.4 Digital Clipper
        5. 8.3.2.5 Closed-Loop Class-D Amplifier
      3. 8.3.3 Speaker Amplifier Protection Suite
        1. 8.3.3.1 Speaker Amplifier Fault Notification (SPK_FAULT Pin)
        2. 8.3.3.2 DC Detect Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Hardware Control Mode
        1. 8.4.1.1 Speaker Amplifier Shut Down (SPK_SD Pin)
        2. 8.4.1.2 Serial Audio Port in Hardware Control Mode
        3. 8.4.1.3 Soft Clipper Control (SFT_CLIP Pin)
        4. 8.4.1.4 Speaker Amplifier Switching Frequency Select (FREQ/SDA Pin)
        5. 8.4.1.5 Parallel Bridge Tied Load Mode Select (PBTL/SCL Pin)
        6. 8.4.1.6 Speaker Amplifier Sleep Enable (SPK_SLEEP/ADR Pin)
        7. 8.4.1.7 Speaker Amplifier Gain Select (SPK_GAIN [1:0] Pins)
        8. 8.4.1.8 Considerations for Setting the Speaker Amplifier Gain Structure
          1. 8.4.1.8.1 Recommendations for Setting the Speaker Amplifier Gain Structure in Hardware Control Mode
      2. 8.4.2 Software Control Mode
        1. 8.4.2.1 Speaker Amplifier Shut Down (SPK_SD Pin)
        2. 8.4.2.2 Serial Audio Port Controls
          1. 8.4.2.2.1 Serial Audio Port (SAP) Clocking
        3. 8.4.2.3 Parallel Bridge Tied Load Mode via Software Control
        4. 8.4.2.4 Speaker Amplifier Gain Structure
          1. 8.4.2.4.1 Speaker Amplifier Gain in Software Control Mode
          2. 8.4.2.4.2 Considerations for Setting the Speaker Amplifier Gain Structure
          3. 8.4.2.4.3 Recommendations for Setting the Speaker Amplifier Gain Structure in Software Control Mode
        5. 8.4.2.5 I²C Software Control Port
          1. 8.4.2.5.1 Setting the I²C Device Address
          2. 8.4.2.5.2 General Operation of the I²C Control Port
          3. 8.4.2.5.3 Writing to the I²C Control Port
          4. 8.4.2.5.4 Reading from the I²C Control Port
    5. 8.5 Register Maps
      1. 8.5.1 Control Port Registers - Quick Reference
      2. 8.5.2 Control Port Registers - Detailed Description
        1. 8.5.2.1  Device Identification Register (0x00)
          1. Table 9. Device Identification Register Field Descriptions
        2. 8.5.2.2  Power Control Register (0x01)
          1. Table 10. Power Control Register Field Descriptions
        3. 8.5.2.3  Digital Control Register (0x02)
          1. Table 11. Digital Control Register Field Descriptions
        4. 8.5.2.4  Volume Control Configuration Register (0x03)
          1. Table 12. Volume Control Configuration Register Field Descriptions
        5. 8.5.2.5  Left Channel Volume Control Register (0x04)
          1. Table 13. Left Channel Volume Control Register Field Descriptions
        6. 8.5.2.6  Right Channel Volume Control Register (0x05)
          1. Table 14. Right Channel Volume Control Register Field Descriptions
        7. 8.5.2.7  Analog Control Register (0x06)
          1. Table 15. Analog Control Register Field Descriptions
        8. 8.5.2.8  Reserved Register (0x07)
        9. 8.5.2.9  Fault Configuration and Error Status Register (0x08)
          1. Table 16. Fault Configuration and Error Status Register Field Descriptions
        10. 8.5.2.10 Reserved Controls (9 / 0x09) - (15 / 0x0F)
        11. 8.5.2.11 Digital Clipper Control 2 Register (0x10)
          1. Table 17. Digital Clipper Control 2 Register Field Descriptions
        12. 8.5.2.12 Digital Clipper Control 1 Register (0x11)
          1. Table 18. Digital Clipper Control 1 Register Field Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Stereo BTL Using Software Control
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Startup Procedures- Software Control Mode
          2. 9.2.1.2.2 Shutdown Procedures- Software Control Mode
          3. 9.2.1.2.3 Component Selection and Hardware Connections
            1. 9.2.1.2.3.1 I²C Pullup Resistors
            2. 9.2.1.2.3.2 Digital I/O Connectivity
          4. 9.2.1.2.4 Recommended Startup and Shutdown Procedures
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Stereo BTL Using Software Control, 32-Pin DAP Package Option
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Startup Procedures- Software Control Mode
          2. 9.2.2.2.2 Shutdown Procedures- Software Control Mode
          3. 9.2.2.2.3 Component Selection and Hardware Connections
            1. 9.2.2.2.3.1 I²C Pullup Resistors
            2. 9.2.2.2.3.2 Digital I/O Connectivity
          4. 9.2.2.2.4 Recommended Startup and Shutdown Procedures
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Stereo BTL Using Hardware Control, 32-Pin DAP Package Option
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Startup Procedures - Hardware Control Mode
          2. 9.2.3.2.2 Shutdown Procedures - Hardware Control Mode
          3. 9.2.3.2.3 Digital I/O Connectivity
        3. 9.2.3.3 Application Curve
      4. 9.2.4 Mono PBTL Using Software Control, 32-Pin DAP Package Option
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 Startup Procedures - Software Control Mode
          2. 9.2.4.2.2 Shutdown Procedures - Software Control Mode
          3. 9.2.4.2.3 Component Selection and Hardware Connections
            1. 9.2.4.2.3.1 I²C Pull-Up Resistors
            2. 9.2.4.2.3.2 Digital I/O Connectivity
              1. 9.2.4.2.3.2.1 Application Curves
      5. 9.2.5 Mono PBTL Using Hardware Control, 32-Pin DAP Package Option
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
          1. 9.2.5.2.1 Startup Procedures - Hardware Control Mode
          2. 9.2.5.2.2 Shutdown Procedures - Hardware Control Mode
          3. 9.2.5.2.3 Digital I/O Connectivity
          4. 9.2.5.2.4 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB Footprint and Via Arrangement
            1. 11.1.3.2.1.1 Solder Stencil
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 支持资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

DCA PACKAGE
48-PIN TSSOP
TOP VIEW
TAS5760M PO_TAS5760x_48DCA.gif

Pin Functions

PIN TYPE(1) INTERNAL TERMINATION DESCRIPTION
NAME NO.
AVDD 46 P - Power supply for internal analog circuitry
ANA_REF 4 P - Connection point for internal reference used by ANA_REG and VCOM filter capacitors
ANA_REG 2 P - Voltage regulator derived from AVDD supply (NOTE: This terminal is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry)
BSTRPA- 39 P - Connection point for the SPK_OUTA- bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTA-
BSTRPA+ 43 P - Connection point for the SPK_OUTA+ bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTA
BSTRPB- 38 P - Connection point for the SPK_OUTB- bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTB-
BSTRPB+ 34 P - Connection point for the SPK_OUTB+ bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTB+
DGND 17 G - Ground for digital circuitry (NOTE: This pin should be connected to the system ground)
DVDD 9 P - Power supply for the internal digital circuitry
FREQ/SDA 7 DI Weak Pull-Down Dual function pin that functions as an I²C data input pin in I²C Control Mode or as a Frequency Select terminal when in Hardware Control Mode.
GGND 47 G - Ground for gate drive circuitry (this terminal should be connected to the system ground)
GVDD_REG 48 P - Voltage regulator derived from PVDD supply (NOTE: This pin is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry)
LRCK 16 DI Weak Pull-Down Word select clock for the digital signal that is active on the serial port's input data line
MCLK 13 DI Weak Pull-Down Master Clock used for internal clock tree, sub-circuit/state machine, and Serial Audio Port clocking
NC 18-31 - - Not connected inside the device (all "no connect" pins should be connected to ground for best thermal performance, however they can be used as routing channels if required.)
PBTL/SCL 8 DI Weak Pull-Down Dual function pin that functions as an I²C clock input terminal in I²C Control Mode or configures the device to operate in pre-filter Parallel Bridge Tied Load (PBTL) mode when in Hardware Control Mode
PGND 36, 41 G - Ground for power device circuitry (NOTE: This terminal should be connected to the system ground)
PVDD 32, 33, 44, 45 P - Power Supply for internal power circuitry
SCLK 14 DI Weak Pull-Down Bit clock for the digital signal that is active on the serial data port's input data line
SDIN 15 DI Weak Pull-Down Data line to the serial data port
SFT_CLIP 1 AI - sets the maximum output voltage before clipping
SPK_FAULT 5 DO - Speaker amplifier fault terminal, which is pulled LOW when an internal fault occurs
SPK_GAIN0 10 DI Weak Pull-Down Adjusts the LSB of the multi-bit gain of the speaker amplifier
SPK_GAIN1 11 DI Weak Pull-Down Adjusts the MSB of the multi-bit gain of the speaker amplifier
SPK_SLEEP/ADR 12 DI Weak Pull-Up In Hardware Control Mode, places the speaker amplifier in sleep mode. In Software Control Mode, is used to determine the I²C Address of the device
SPK_OUTA- 40 AO - Negative pin for differential speaker amplifier output A
SPK_OUTA+ 42 AO - Positive pin for differential speaker amplifier output A
SPK_OUTB- 37 AO - Negative pin for differential speaker amplifier output B
SPK_OUTB+ 35 AO - Positive pin for differential speaker amplifier output B
SPK_SD 6 AO - Places the speaker amplifier in shutdown
VCOM 3 P - Bias voltage for internal PWM conversion block
PowerPAD™ - G - Provides both electrical and thermal connection from the device to the board. A matching ground pad must be provided on the PCB and the device connected to it via solder. For proper electrical operation, this ground pad must be connected to the system ground.
DAP PACKAGE
32-PIN TSSOP
TOP VIEW
TAS5760M PO_TAS5760x_32DAP.gif

Pin Functions

PIN TYPE(1) INTERNAL TERMINATION DESCRIPTION
NAME NO.
AVDD 1 P - Power supply for internal analog circuitry
ANA_REF 5 P - Connection point for internal reference used by ANA_REG and VCOM filter capacitors
ANA_REG 3 P - Voltage regulator derived from AVDD supply (NOTE: This terminal is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry)
BSTRPA– 25 P - Connection point for the SPK_OUTA– bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTA–
BSTRPA+ 30 P - Connection point for the SPK_OUTA+ bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTA
BSTRPB– 24 P - Connection point for the SPK_OUTB- bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTB-
BSTRPB+ 19 P - Connection point for the SPK_OUTB+ bootstrap capacitor, which is used to create a power supply for the high-side gate drive for SPK_OUTB+
DGND 18 G - Ground for digital circuitry (NOTE: This terminal should be connected to the system ground)
DVDD 10 P - Power supply for the internal digital circuitry
FREQ/SDA 8 DI Weak Pull-Down Dual function terminal that functions as an I²C data input terminal in I²C Control Mode or as a Frequency Select terminal when in Hardware Control Mode.
GGND 31 G - Ground for gate drive circuitry (this terminal should be connected to the system ground)
GVDD_REG 32 P - Voltage regulator derived from PVDD supply (NOTE: This terminal is provided as a connection point for filtering capacitors for this supply and must not be used to power any external circuitry)
LRCK 17 DI Weak Pull-Down Word select clock for the digital signal that is active on the serial port's input data line
MCLK 14 DI Weak Pull-Down Master Clock used for internal clock tree, sub-circuit/state machine, and Serial Audio Port clocking
PBTL/SCL 9 DI Weak Pull-Down Dual function terminal that functions as an I²C clock input terminal in I²C Control Mode or configures the device to operate in pre-filter Parallel Bridge Tied Load (PBTL) mode when in Hardware Control Mode
PGND 22, 27 G - Ground for power device circuitry (NOTE: This terminal should be connected to the system ground)
PVDD 21, 28 P - Power Supply for internal power circuitry
SCLK 15 DI Weak Pull-Down Bit clock for the digital signal that is active on the serial data port's input data line
SDIN 16 DI Weak Pull-Down Data line to the serial data port
SFT_CLIP 2 AI - Sets the maximum output voltage before clipping
SPK_FAULT 6 DO Open Drain Fault terminal, which is pulled LOW when an internal fault occurs
SPK_GAIN0 11 DI Weak Pull-Down Adjusts the LSB of the multi-bit gain of the speaker amplifier
SPK_GAIN1 12 DI Weak Pull-Down Adjusts the MSB of the multi-bit gain of the speaker amplifier
SPK_SLEEP/ADR 13 DI Weak Pull-Up Places the speaker amplifier in mute
SPK_OUTA– 26 AO - Negative terminal for differential speaker amplifier output
SPK_OUTA+ 29 AO - Positive terminal for differential speaker amplifier output
SPK_OUTB– 23 AO - Negative terminal for differential speaker amplifier output B
SPK_OUTB+ 20 AO - Positive terminal for differential speaker amplifier output B
SPK_SD 7 DI - Places the device in shutdown when pulled LOW
VCOM 4 P - Bias voltage for internal PWM conversion block
PowerPAD™ - G - Provides both electrical and thermal connection from the device to the board. A matching ground pad must be provided on the PCB and the device connected to it via solder.
AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, P = Power, G = Ground (0 V)