ZHCSDC1D September 2013 – October 2018 TAS5766M , TAS5768M
PRODUCTION DATA.
Because the layout is important to the overall performance of the circuit, the package size of the components shown in the component list were intentionally chosen to allow for proper board layout, component placement, and trace routing. In some cases, traces are passed in between two surface mount pads or ground plane extends from the TAS5766M device between two pads of a surface mount component and into to the surrounding copper for increased heat-sinking of the device. While components may be offered in smaller or larger package sizes, it is highly recommended that the package size remain identical to that used in the application circuit as shown. This consistency ensures that the layout and routing can be matched very closely, optimizing thermal, electromagnetic, and audio performance of the TAS5766M device in circuit in the final system.