ZHCSIC2H October   2019  – January 2023 TAS5825M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
      1. 7.7.1 Bridge Tied Load (BTL) Configuration Curves with Hybrid Modulation
      2. 7.7.2 Parallel Bridge Tied Load (PBTL) Configuration With Hybrid Modulation
      3. 7.7.3 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      4. 7.7.4 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power Supplies
      2. 9.3.2 Device Clocking
      3. 9.3.3 Serial Audio Port – Clock Rates
      4. 9.3.4 Clock Halt Auto-Recovery
      5. 9.3.5 Sample Rate on the Fly Change
      6. 9.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 9.3.7 Digital Audio Processing
      8. 9.3.8 Class D Audio Amplifier
        1. 9.3.8.1 Speaker Amplifier Gain Select
        2. 9.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Software Control
      2. 9.4.2 Speaker Amplifier Operating Modes
        1. 9.4.2.1 BTL Mode
        2. 9.4.2.2 PBTL Mode
      3. 9.4.3 Low EMI Modes
        1. 9.4.3.1 Spread Spectrum
        2. 9.4.3.2 Channel to Channel Phase Shift
        3. 9.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 9.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 9.4.3.3.2 Phase Synchronization With GPIO
      4. 9.4.4 Thermal Foldback
      5. 9.4.5 Device State Control
      6. 9.4.6 Device Modulation
        1. 9.4.6.1 BD Modulation
        2. 9.4.6.2 1SPW Modulation
        3. 9.4.6.3 Hybrid Modulation
    5. 9.5 Programming and Control
      1. 9.5.1 I2 C Serial Communication Bus
      2. 9.5.2 I2 C Target Address
        1. 9.5.2.1 Random Write
        2. 9.5.2.2 Sequential Write
        3. 9.5.2.3 Random Read
        4. 9.5.2.4 Sequential Read
        5. 9.5.2.5 DSP Memory Book, Page and BQ update
        6. 9.5.2.6 Checksum
          1. 9.5.2.6.1 Cyclic Redundancy Check (CRC) Checksum
          2. 9.5.2.6.2 Exclusive or (XOR) Checksum
      3. 9.5.3 Control via Software
        1. 9.5.3.1 Startup Procedures
        2. 9.5.3.2 Shutdown Procedures
        3. 9.5.3.3 Protection and Monitoring
          1. 9.5.3.3.1 Overcurrent Limit (Cycle-By-Cycle)
          2. 9.5.3.3.2 Overcurrent Shutdown (OCSD)
          3. 9.5.3.3.3 DC Detect
    6. 9.6 Register Maps
      1. 9.6.1 CONTROL PORT Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Inductor Selections
      2. 10.1.2 Bootstrap Capacitors
      3. 10.1.3 Power Supply Decoupling
      4. 10.1.4 Output EMI Filtering
    2. 10.2 Typical Applications
      1. 10.2.1 2.0 (Stereo BTL) System
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design procedures
        1. 10.2.3.1 Step One: Hardware Integration
        2. 10.2.3.2 Step Two: Hardware Integration
        3. 10.2.3.3 Step Three: Software Integration
      4. 10.2.4 Application Curves
      5. 10.2.5 MONO (PBTL) Systems
      6. 10.2.6 Advanced 2.1 System (Two TAS5825M Devices)
      7. 10.2.7 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 DVDD Supply
      2. 10.3.2 PVDD Supply
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 General Guidelines for Audio Amplifiers
        2. 10.4.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
        3. 10.4.1.3 Optimizing Thermal Performance
          1. 10.4.1.3.1 Device, Copper, and Component Layout
          2. 10.4.1.3.2 Stencil Pattern
            1. 10.4.1.3.2.1 PCB footprint and Via Arrangement
            2. 10.4.1.3.2.2 Solder Stencil
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Development Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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9.4.6.2 1SPW Modulation

The 1SPW mode alters the normal modulation scheme to achieve higher efficiency with a slight penalty in THD degradation and more attention required in the output filter selection. In Low Idle Current mode, the outputs operate at approximately 17% modulation during idle conditions. When an audio signal is applied, one output decreases and one increases. The decreasing output signal rails to GND. At this point all the audio modulation takes place through the rising output. The result is that only one output is switching during a majority of the audio cycle. Efficiency is improved in this mode due to the reduction of switching losses.

GUID-0F1FA2FB-5493-4C2E-A6FB-B75E734F4174-low.gifFigure 9-9 1SPW Mode Modulation
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