ZHCSO77A June   2021  – December 2021 TAS5828M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      2. 6.7.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
      3. 6.7.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
      4. 6.7.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supplies
      2. 8.3.2 Device Clocking
      3. 8.3.3 Serial Audio Port – Clock Rates
      4. 8.3.4 Clock Halt Auto-recovery
      5. 8.3.5 Sample Rate on the Fly Change
      6. 8.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 8.3.7 Digital Audio Processing
      8. 8.3.8 Class D Audio Amplifier
        1. 8.3.8.1 Speaker Amplifier Gain Select
        2. 8.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Software Control
      2. 8.4.2 Speaker Amplifier Operating Modes
        1. 8.4.2.1 BTL Mode
        2. 8.4.2.2 PBTL Mode
      3. 8.4.3 Low EMI Modes
        1. 8.4.3.1 Spread Spectrum
        2. 8.4.3.2 Channel to Channel Phase Shift
        3. 8.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 8.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 8.4.3.3.2 Phase Synchronization With GPIO
      4. 8.4.4 Thermal Foldback
      5. 8.4.5 Device State Control
      6. 8.4.6 Device Modulation
        1. 8.4.6.1 BD Modulation
        2. 8.4.6.2 1SPW Modulation
        3. 8.4.6.3 Hybrid Modulation
    5. 8.5 Programming and Control
      1. 8.5.1 I2 C Serial Communication Bus
      2. 8.5.2 Hardware Control Mode
      3. 8.5.3 I2 C Target Address
        1. 8.5.3.1 Random Write
        2. 8.5.3.2 Sequential Write
        3. 8.5.3.3 Random Read
        4. 8.5.3.4 Sequential Read
        5. 8.5.3.5 DSP Memory Book, Page and BQ update
        6. 8.5.3.6 Checksum
          1. 8.5.3.6.1 Cyclic Redundancy Check (CRC) Checksum
          2. 8.5.3.6.2 Exclusive or (XOR) Checksum
      4. 8.5.4 Control via Software
        1. 8.5.4.1 Startup Procedures
        2. 8.5.4.2 Shutdown Procedures
      5. 8.5.5 Protection and Monitoring
        1. 8.5.5.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 8.5.5.2 Overcurrent Shutdown (OCSD)
        3. 8.5.5.3 DC Detect Error
        4. 8.5.5.4 Overtemperature Shutdown (OTSD)
        5. 8.5.5.5 PVDD Overvoltage and Undervoltage Error
        6. 8.5.5.6 PVDD Drop Detection
        7. 8.5.5.7 Clock Fault
    6. 8.6 Register Maps
      1. 8.6.1 CONTROL PORT Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor Selections
      2. 9.1.2 Bootstrap Capacitors
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 2.0 (Stereo BTL) System
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design procedures
        1. 9.2.3.1 Step One: Hardware Integration
        2. 9.2.3.2 Step Two: Hardware Integration
        3. 9.2.3.3 Step Three: Software Integration
      4. 9.2.4 MONO (PBTL) Systems
      5. 9.2.5 Advanced 2.1 System (Two TAS5828M Devices)
  10. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB footprint and Via Arrangement
          2. 11.1.3.2.2 Solder Stencil
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
      2. 12.1.2 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DAD|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

TAS5828M 是一款立体声、高性能闭环 D 类放大器，具有集成的音频处理器和高达 192kHz 的架构。

软件控制模式启动后，TAS5828M 不仅实现了经典的 BQ、3 频带 DRC 和 AGL，还实现了 Hybrid-Pro 专有算法。Hybrid-Pro 算法可检测即将发生的音频功率需求，并通过 Hybrid-Pro 反馈引脚 (HPFB) 为前直流/直流转换器提供 PWM 格式控制信号。TAS5828M 支持用于可预测的包络跟踪、高达 4ms 的音频信号延迟缓冲器，这有助于防止因直流/直流电压调整而导致的音频削波。

在设置为硬件控制模式时，TAS5828M 通过引脚配置支持开关频率、模拟增益、BTL/PBTL 模式和逐周期电流限制阈值。此模式专为免去终端系统软件驱动程序集成工作而设计。

器件信息
器件型号封装(1)封装尺寸（标称值）
TAS5828MTSSOP (32) DAD11.00mm × 6.20mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
GUID-6EAD96CD-7FA0-49C8-B573-8C6623C2CB25-low.gif简化版原理图
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