ZHCSO77A June   2021  – December 2021 TAS5828M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      2. 6.7.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
      3. 6.7.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
      4. 6.7.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supplies
      2. 8.3.2 Device Clocking
      3. 8.3.3 Serial Audio Port – Clock Rates
      4. 8.3.4 Clock Halt Auto-recovery
      5. 8.3.5 Sample Rate on the Fly Change
      6. 8.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 8.3.7 Digital Audio Processing
      8. 8.3.8 Class D Audio Amplifier
        1. 8.3.8.1 Speaker Amplifier Gain Select
        2. 8.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Software Control
      2. 8.4.2 Speaker Amplifier Operating Modes
        1. 8.4.2.1 BTL Mode
        2. 8.4.2.2 PBTL Mode
      3. 8.4.3 Low EMI Modes
        1. 8.4.3.1 Spread Spectrum
        2. 8.4.3.2 Channel to Channel Phase Shift
        3. 8.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 8.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 8.4.3.3.2 Phase Synchronization With GPIO
      4. 8.4.4 Thermal Foldback
      5. 8.4.5 Device State Control
      6. 8.4.6 Device Modulation
        1. 8.4.6.1 BD Modulation
        2. 8.4.6.2 1SPW Modulation
        3. 8.4.6.3 Hybrid Modulation
    5. 8.5 Programming and Control
      1. 8.5.1 I2 C Serial Communication Bus
      2. 8.5.2 Hardware Control Mode
      3. 8.5.3 I2 C Target Address
        1. 8.5.3.1 Random Write
        2. 8.5.3.2 Sequential Write
        3. 8.5.3.3 Random Read
        4. 8.5.3.4 Sequential Read
        5. 8.5.3.5 DSP Memory Book, Page and BQ update
        6. 8.5.3.6 Checksum
          1. 8.5.3.6.1 Cyclic Redundancy Check (CRC) Checksum
          2. 8.5.3.6.2 Exclusive or (XOR) Checksum
      4. 8.5.4 Control via Software
        1. 8.5.4.1 Startup Procedures
        2. 8.5.4.2 Shutdown Procedures
      5. 8.5.5 Protection and Monitoring
        1. 8.5.5.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 8.5.5.2 Overcurrent Shutdown (OCSD)
        3. 8.5.5.3 DC Detect Error
        4. 8.5.5.4 Overtemperature Shutdown (OTSD)
        5. 8.5.5.5 PVDD Overvoltage and Undervoltage Error
        6. 8.5.5.6 PVDD Drop Detection
        7. 8.5.5.7 Clock Fault
    6. 8.6 Register Maps
      1. 8.6.1 CONTROL PORT Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor Selections
      2. 9.1.2 Bootstrap Capacitors
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 2.0 (Stereo BTL) System
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design procedures
        1. 9.2.3.1 Step One: Hardware Integration
        2. 9.2.3.2 Step Two: Hardware Integration
        3. 9.2.3.3 Step Three: Software Integration
      4. 9.2.4 MONO (PBTL) Systems
      5. 9.2.5 Advanced 2.1 System (Two TAS5828M Devices)
  10. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB footprint and Via Arrangement
          2. 11.1.3.2.2 Solder Stencil
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
      2. 12.1.2 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

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机械数据 (封装 | 引脚)
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散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.7 Digital Audio Processing

TAS5828M digital audio processing includes three main functions: basic audio tuning blocks, Hybrid-Pro algorithm and advanced features.

Basic audio tuning blocks are SRC (sample rate converter), stereo channel Input Mixer, 15 BQs for each channel, pop click free Volume, multi-bands DRC, and AGL. Detailed introduction of each block can be found with TAS5825M Process Flows.

Hybrid-Pro can be used in conjunction with Hybrid Modulation, which is an innovative Class-D internal PWM modulation scheme to improve efficiency even more without compromising THD+N performance. Hybrid-Pro goes beyond Hybrid PWM modulation from system efficiency perspective, by tracking audio signal envelope with advanced look-ahead DSP structure, controlling the external PVDD supply voltage rail, and maintaining just enough margin to provide high dynamic range without clipping distortion to save as much power as possible. Refer TAS5828M User Guide for more configurable options:

  • Optional 8 steps 384 kHz PWM format or 16 steps 192 kHz PWM format Hybrid-Pro control waveform for external DC-DC converter.
  • Configurable max 4 ms look-ahead audio signal delay buffer, which provides capability to fit various applications systems' DC-DC bandwidth and power supply coupling capacitance.
  • Max 512 samples audio signal peak hold to optimize power supply voltage rail transition from large audio input to small level, which is useful to avoid clipping distortion.
  • Hybrid-Pro Margin automatically adjusts audio signal trigger level and each step level. Fine tune it to achieve the balance between efficiency and envelope tracking speed.

Advanced features include PVDD Sensing (Dynamic Headroom Tracking), Thermal Foldback and Hybrid PWM modulation. They are implemented based on integrated 8-bit PVDD sense ADC and 4 level temperature sensor. Refer to application note:TAS5825M Advanced Features.
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