ZHCSO75A June   2021  – November 2021 TAS6424E-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 ESD Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics: Bridge-Tied Load (BTL)
    7. 7.7 Typical Characteristics: Bridge-Tied Load (BTL, 384 kHz)
    8. 7.8 Typical Characteristics: Parallel Bridge-Tied (PBTL)
    9. 7.9 Typical Characteristics: Parallel Bridge-Tied Load (PBTL, 384 kHz)
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Serial Audio Port
        1. 9.3.1.1 I2S Mode
        2. 9.3.1.2 Left-Justified Timing
        3. 9.3.1.3 Right-Justified Timing
        4. 9.3.1.4 TDM Mode
        5. 9.3.1.5 Supported Clock Rates
        6. 9.3.1.6 Audio-Clock Error Handling
      2. 9.3.2  DC Blocking
      3. 9.3.3  Volume Control and Gain
      4. 9.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 9.3.5  EMI Management Features
        1. 9.3.5.1 Spread-Spectrum
        2. 9.3.5.2 Channel-to-Channel Output Phase Control
      6. 9.3.6  Gate Drive
      7. 9.3.7  Power FETs
      8. 9.3.8  Load Diagnostics
        1. 9.3.8.1 DC Load Diagnostics
        2. 9.3.8.2 Line Output Diagnostics
        3. 9.3.8.3 AC Load Diagnostics
          1. 9.3.8.3.1 Impedance Magnitude Measurement
          2. 9.3.8.3.2 Impedance Phase Reference Measurement
          3. 9.3.8.3.3 Impedance Phase Measurement
      9. 9.3.9  Protection and Monitoring
        1. 9.3.9.1 Overcurrent Limit (ILIMIT)
        2. 9.3.9.2 Overcurrent Shutdown (ISD)
        3. 9.3.9.3 DC Detect
        4. 9.3.9.4 Clip Detect
        5. 9.3.9.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 9.3.9.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 9.3.9.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 9.3.9.8 Overvoltage (OV) and Load Dump
      10. 9.3.10 Power Supply
        1. 9.3.10.1 Vehicle-Battery Power-Supply Sequence
          1. 9.3.10.1.1 Power-Up Sequence
          2. 9.3.10.1.2 Power-Down Sequence
        2. 9.3.10.2 Boosted Power-Supply Sequence
      11. 9.3.11 Hardware Control Pins
        1. 9.3.11.1 FAULT
        2. 9.3.11.2 WARN
        3. 9.3.11.3 MUTE
        4. 9.3.11.4 STANDBY
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes and Faults
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Communication Bus
      2. 9.5.2 I2C Bus Protocol
      3. 9.5.3 Random Write
      4. 9.5.4 Sequential Write
      5. 9.5.5 Random Read
      6. 9.5.6 Sequential Read
    6. 9.6 Register Maps
      1. 9.6.1  Mode Control Register (address = 0x00) [default = 0x00]
      2. 9.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 9.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 9.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
      5. 9.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
      6. 9.6.6  Channel 1 Through 4 Volume Control Registers (address = 0x05–0x08) [default = 0xCF]
      7. 9.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      8. 9.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      9. 9.6.9  DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
      10. 9.6.10 DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      11. 9.6.11 DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
      12. 9.6.12 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
      13. 9.6.13 Channel State Reporting Register (address = 0x0F) [default = 0x55]
      14. 9.6.14 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
      15. 9.6.15 Global Faults 1 Register (address = 0x11) [default = 0x00]
      16. 9.6.16 Global Faults 2 Register (address = 0x12) [default = 0x00]
      17. 9.6.17 Warnings Register (address = 0x13) [default = 0x20]
      18. 9.6.18 Pin Control Register (address = 0x14) [default = 0x00]
      19. 9.6.19 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      20. 9.6.20 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      21. 9.6.21 AC Load Diagnostic Impedance Report Ch1 through Ch4 Registers (address = 0x17–0x1A) [default = 0x00]
      22. 9.6.22 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
      23. 9.6.23 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
      24. 9.6.24 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
      25. 9.6.25 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
      26. 9.6.26 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      27. 9.6.27 Clip Control Register (address = 0x22) [default = 0x01]
      28. 9.6.28 Clip Window Register (address = 0x23) [default = 0x14]
      29. 9.6.29 Clip Warning Register (address = 0x24) [default = 0x00]
      30. 9.6.30 ILIMIT Status Register (address = 0x25) [default = 0x00]
      31. 9.6.31 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
      32. 9.6.32 Miscellaneous Control 5 Register (address = 0x28) [default = 0x0A]
      33. 9.6.33 Spread-Spectrum Control 1 Register (address = 0x77) [default = 0x00]
      34. 9.6.34 Spread Spectrum Control 2 Register (address = 0x78) [default = 0x3F]
      35. 9.6.35 Spread Spectrum Control 3 Register (address = 0x79) [default = 0x00]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 AM-Radio Band Avoidance
      2. 10.1.2 Parallel BTL Operation (PBTL)
      3. 10.1.3 Demodulation Filter Design
      4. 10.1.4 Line Driver Applications
    2. 10.2 Typical Application
      1. 10.2.1 BTL Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Communication
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Hardware Design
          2. 10.2.1.2.2 Digital Input and the Serial Audio Port
          3. 10.2.1.2.3 Bootstrap Capacitors
          4. 10.2.1.2.4 Output Reconstruction Filter
      2. 10.2.2 PBTL Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Electrical Connection of Thermal pad and Heat Sink
      2. 12.1.2 EMI Considerations
      3. 12.1.3 General Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DKQ|56
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

Figure 6-1 DKQ Package, 56-Pin HSSOP With Exposed Thermal Pad, Top View
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
AREF 4 PWR VREG and VCOM bypass capacitor return
AVDD 8 PWR Voltage regulator bypass. Connect 1 µF capacitor from AVDD to AVSS
AVSS 7 PWR AVDD bypass capacitor return
BST_1M 31 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_1P 35 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_2M 37 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_2P 41 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_3M 44 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_3P 48 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_4M 50 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_4P 54 PWR Bootstrap capacitor connection pins for high-side gate driver
FAULT 26 DO Reports a fault (active low, open drain), 100-kΩ internal pull-up resistor
FSYNC 14 DI Audio frame clock input
GND 1, 11, 17, 18, 28, 33, 36, 39, 46, 49, 52 GND Ground
GVDD 9 PWR Gate drive voltage regulator derived from VBAT input pin. Connect 2.2 µF capacitor to GND
10 Gate drive voltage regulator derived from VBAT input pin. Connect 2.2 µF capacitor to GND
I2C_ADDR0 22 DI I2C address pins. Refer to Figure 9-8
I2C_ADDR1 23
MCLK 12 DI Audio master clock input
MUTE 25 DI Mutes the device outputs (active low) while keeping output FETs switching at 50%, 100-kΩ internal pull-down resistor
OUT_1M 32 NO Negative output for the channel
OUT_1P 34 PO Positive output for the channel
OUT_2M 38 NO Negative output for the channel
OUT_2P 40 PO Positive output for the channel
OUT_3M 45 NO Negative output for the channel
OUT_3P 47 PO Positive output for the channel
OUT_4M 51 NO Negative output for the channel
OUT_4P 53 PO Positive output for the channel
PVDD 2, 29, 30, 42, 43, 55, 56 PWR PVDD voltage input (can be connected to battery). Bulk capacitor and bypass capacitor required
SCL 20 DI I2C clock input
SCLK 13 DI Audio bit and serial clock input
SDA 21 DI/O I2C data input and output
SDIN1 15 DI TDM data input and audio I2S data input for channels 1 and 2
SDIN2 16 DI Audio I2S data input for channels 3 and 4
STANDBY 24 DI Enables low power standby state (active Low), 100-kΩ internal pull-down resistor
VBAT 3 PWR Battery voltage input
VCOM 6 PWR Bias voltage
VDD 19 PWR 3.3-V external supply voltage
VREG 5 PWR Voltage regulator bypass
WARN 27 DO Clip and overtemperature warning (active low, open drain), 100-kΩ internal pull-up resistor
Thermal Pad — GND Provides both electrical and thermal connection for the device. Heatsink must be connected to GND.
(1) GND = ground, PWR = power, PO = positive output, NO = negative output, DI = digital input, DO = digital output, DI/O = digital input and output, NC = no connection
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