ZHCSJB8 February   2019 TAS6424M-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     PCB 区域
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Serial Audio Port
        1. 10.3.1.1 I2S Mode
        2. 10.3.1.2 Left-Justified Timing
        3. 10.3.1.3 Right-Justified Timing
        4. 10.3.1.4 TDM Mode
        5. 10.3.1.5 Supported Clock Rates
        6. 10.3.1.6 Audio-Clock Error Handling
      2. 10.3.2  High-Pass Filter
      3. 10.3.3  Volume Control and Gain
      4. 10.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 10.3.5  Gate Drive
      6. 10.3.6  Power FETs
      7. 10.3.7  Load Diagnostics
        1. 10.3.7.1 DC Load Diagnostics
        2. 10.3.7.2 Line Output Diagnostics
        3. 10.3.7.3 AC Load Diagnostics
          1. 10.3.7.3.1 Impedance Magnitude Measurement
          2. 10.3.7.3.2 Impedance Phase Reference Measurement
          3. 10.3.7.3.3 Impedance Phase Measurement
      8. 10.3.8  Protection and Monitoring
        1. 10.3.8.1 Overcurrent Limit (ILIMIT)
        2. 10.3.8.2 Overcurrent Shutdown (ISD)
        3. 10.3.8.3 DC Detect
        4. 10.3.8.4 Clip Detect
        5. 10.3.8.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 10.3.8.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 10.3.8.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 10.3.8.8 Overvoltage (OV) and Load Dump
      9. 10.3.9  Power Supply
        1. 10.3.9.1 Vehicle-Battery Power-Supply Sequence
        2. 10.3.9.2 Boosted Power-Supply Sequence
      10. 10.3.10 Hardware Control Pins
        1. 10.3.10.1 FAULT
        2. 10.3.10.2 WARN
        3. 10.3.10.3 MUTE
        4. 10.3.10.4 STANDBY
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Modes and Faults
    5. 10.5 Programming
      1. 10.5.1 I2C Serial Communication Bus
      2. 10.5.2 I2C Bus Protocol
      3. 10.5.3 Random Write
      4. 10.5.4 Sequential Write
      5. 10.5.5 Random Read
      6. 10.5.6 Sequential Read
    6. 10.6 Register Maps
      1. 10.6.1  Mode Control Register (address = 0x00) [default = 0x00]
        1. Table 10. Mode Control Field Descriptions
      2. 10.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
        1. Table 11. Misc Control 1 Field Descriptions
      3. 10.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
        1. Table 12. Misc Control 2 Field Descriptions
      4. 10.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
        1. Table 13. SAP Control Field Descriptions
      5. 10.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
        1. Table 14. Channel State Control Field Descriptions
      6. 10.6.6  Channel 1 Through 4 Volume Control Registers (address = 0x05–0x08) [default = 0xCF]
        1. Table 15. Ch x Volume Control Field Descriptions
      7. 10.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
        1. Table 16. DC Load Diagnostics Control 1 Field Descriptions
      8. 10.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
        1. Table 17. DC Load Diagnostics Control 2 Field Descriptions
      9. 10.6.9  DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
        1. Table 18. DC Load Diagnostics Control 3 Field Descriptions
      10. 10.6.10 DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
        1. Table 19. DC Load Diagnostics Report 1 Field Descriptions
      11. 10.6.11 DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
        1. Table 20. DC Load Diagnostics Report 2 Field Descriptions
      12. 10.6.12 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
        1. Table 21. DC Load Diagnostics Report 3 Line Output Field Descriptions
      13. 10.6.13 Channel State Reporting Register (address = 0x0F) [default = 0x55]
        1. Table 22. State-Reporting Field Descriptions
      14. 10.6.14 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
        1. Table 23. Channel Faults Field Descriptions
      15. 10.6.15 Global Faults 1 Register (address = 0x11) [default = 0x00]
        1. Table 24. Global Faults 1 Field Descriptions
      16. 10.6.16 Global Faults 2 Register (address = 0x12) [default = 0x00]
        1. Table 25. Global Faults 2 Field Descriptions
      17. 10.6.17 Warnings Register (address = 0x13) [default = 0x20]
        1. Table 26. Warnings Field Descriptions
      18. 10.6.18 Pin Control Register (address = 0x14) [default = 0x00]
        1. Table 27. Pin Control Field Descriptions
      19. 10.6.19 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
        1. Table 28. AC Load Diagnostic Control 1 Field Descriptions
      20. 10.6.20 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
        1. Table 29. AC Load Diagnostic Control 2 Field Descriptions
      21. 10.6.21 AC Load Diagnostic Impedance Report Ch1 through CH4 Registers (address = 0x17–0x1A) [default = 0x00]
        1. Table 30. Chx AC LDG Impedance Report Field Descriptions
      22. 10.6.22 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
        1. Table 31. AC LDG Phase High Report Field Descriptions
      23. 10.6.23 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
        1. Table 32. AC LDG Phase Low Report Field Descriptions
      24. 10.6.24 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
        1. Table 33. AC LDG STI High Report Field Descriptions
      25. 10.6.25 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
        1. Table 34. Chx AC LDG STI Low Report Field Descriptions
      26. 10.6.26 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
        1. Table 35. Misc Control 3 Field Descriptions
      27. 10.6.27 Clip Control Register (address = 0x22) [default = 0x01]
        1. Table 36. Clip Control Field Descriptions
      28. 10.6.28 Clip Window Register (address = 0x23) [default = 0x14]
        1. Table 37. Clip Window Field Descriptions
      29. 10.6.29 Clip Warning Register (address = 0x24) [default = 0x00]
        1. Table 38. Clip Warning Field Descriptions
      30. 10.6.30 ILIMIT Status Register (address = 0x25) [default = 0x00]
        1. Table 39. ILIMIT Status Field Descriptions
      31. 10.6.31 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
        1. Table 40. Misc Control 4 Field Descriptions
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 AM-Radio Band Avoidance
      2. 11.1.2 Parallel BTL Operation (PBTL)
      3. 11.1.3 Demodulation Filter Design
      4. 11.1.4 Line Driver Applications
    2. 11.2 Typical Applications
      1. 11.2.1 BTL Application
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Communication
        3. 11.2.1.3 Detailed Design Procedure
          1. 11.2.1.3.1 Hardware Design
          2. 11.2.1.3.2 Digital Input and the Serial Audio Port
          3. 11.2.1.3.3 Bootstrap Capacitors
          4. 11.2.1.3.4 Output Reconstruction Filter
        4. 11.2.1.4 Application Curves
      2. 11.2.2 PBTL Application
        1. 11.2.2.1 Design Requirements
          1. 11.2.2.1.1 Detailed Design Procedure
        2. 11.2.2.2 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Electrical Connection of Thermal pad and Heat Sink
      2. 13.1.2 EMI Considerations
      3. 13.1.3 General Guidelines
    2. 13.2 Layout Example
    3. 13.3 Thermal Considerations
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档
    2. 14.2 接收文档更新通知
    3. 14.3 社区资源
    4. 14.4 商标
    5. 14.5 静电放电警告
    6. 14.6 术语表
  15. 15机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.6 Timing Requirements

Test conditions (unless otherwise noted): TC = 25 °C, PVDD = VBAT = 14.4 V, VDD = 3.3 V, RL = 4 Ω, PO = 1 W/ch, ƒ = 1 kHz, fSW = 2.11 MHz, AES17 Filter, default I2C settings, see Figure 79
MIN TYP MAX UNIT
I2C CONTROL PORT (See Figure 42)
tBUS Bus free time between a STOP and START condition 1.3 μs
tHOLD1 Hold time, SCL to SDA 0 ns
tHOLD2 Hold time, start condition to SCL 0.6 μs
tSTART I2C startup time after VDD power on reset 12 ms
tRISE Rise time, SCL and SDA 300 ns
tFALL Fall time, SCL and SDA 300 ns
tSU1 Setup, SDA to SCL 100 ns
tSU2 Setup, SCL to start condition 0.6 μs
tSU3 Setup, SCL to stop condition 0.6 μs
tW(H) Required pulse duration SCL High 0.6 μs
tW(L) Required pulse duration SCL Low 1.3 μs
SERIAL AUDIO PORT (See Figure 32)
DMCLK, DSCLK Allowable input clock duty cycle 45% 50% 55%
ƒMCLK Supported MCLK frequencies: 128, 256, or 512 128 512 xFS
ƒMCLK_Max Maximum frequency 25 MHz
tSCY SCLK pulse cycle time 40 ns
tSCL SCLK pulse-with LOW 16 ns
tSCH SCLK pulse-with HIGH 16 ns
trise/fall Rise and fall time <5 ns
tSF SCLK rising edge to FSYNC edge 8 ns
tFS FSYNC rising edge to SCLK edge 8 ns
tDS DATA set-up time 8 ns
tDH DATA hold time 8 ns
ci Input capacitance, pins MCLK, SCLK, FSYNC, SDIN1, SDIN2 10 pF
TLA Latency from input to output measured in FSYNC sample count FSYNC = 44.1 kHz or 48 kHz 30
FSYNC = 96 kHz 12
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