ZHCS034C January   2011  – August 2018 TCA4311A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 READY Digital Output
      3. 8.3.3 EN Low Current Disable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Connection Circuitry
      3. 8.4.3 Missing ACK Event
        1. 8.4.3.1 System Impact
        2. 8.4.3.2 System Workaround
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Input to Output Offset Voltage
        2. 9.2.1.2 Propagation Delays
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Pull-Up Value Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Live Insertion and Capacitance Buffering CompactPCI Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Live Insertion and Capacitance Buffering PCI Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Curves
      6. 9.2.6 Repeater/Bus Extender Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
        3. 9.2.6.3 Application Curves
      7. 9.2.7 Systems With Disparate Supply Voltages
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
        3. 9.2.7.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power Supply
VCC Positive supply voltage 2.7 5.5 V
ICC Supply current VCC = 5.5 V, VSDAIN = VSCLIN = 0 V 5.1 7 mA
ISD Supply current in shutdown mode VEN = 0 V 0.1 μA
Start-Up Circuitry
VPRE Pre-charge voltage SDA, SCL floating 0.8 1 1.2 V
tIDLE Bus idle time 50 95 150 μs
VEN EN threshold voltage 0.5 × VCC 0.9 × VCC V
VDIS Disable threshold voltage EN Pin 0.1 × VCC 0.5 × VCC V
IEN EN input current EN from 0 V to VCC ±0.1 ±1 μA
tEN Enable time 95 μs
tDIS Disable time (EN to READY) 30 ns
tSTOP SDAIN to READY delay after STOP 1.2 μs
tREADY SCLOUT/SDAOUT to READY 0.8 μs
IOFF READY OFF state leakage current ±0.1 μA
VOL READY output low voltage IPULLUP = 3 mA 0.4 V
Rise-Time Accelerators
IPULLUPAC Transient boosted pull-up current Positive transition on SDA, SCL, VCC = 2.7 V, 1 8 mA
Input-Output Connection
VOS Input-output offset voltage 10 kΩ to VCC on SDA, SCL, VCC = 3.3 V,(1) 0 100 175 mV
CIN Digital input capacitance 10 pF
VOL Output low voltage, input = 0 V SDA, SCL pins, ISINK = 3 mA, 0 0.4 V
II Input leakage current SDA, SCL pins = VCC = 5.5 V ±5 μA
(1) The connection circuitry always regulates its output to a higher voltage than its input. The magnitude of this offset voltage as a function of the pull-up resistor and VCC voltage is shown in the Typical Characteristics section.
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