ZHCS034C January   2011  – August 2018 TCA4311A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 READY Digital Output
      3. 8.3.3 EN Low Current Disable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Connection Circuitry
      3. 8.4.3 Missing ACK Event
        1. 8.4.3.1 System Impact
        2. 8.4.3.2 System Workaround
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Input to Output Offset Voltage
        2. 9.2.1.2 Propagation Delays
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Pull-Up Value Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Live Insertion and Capacitance Buffering CompactPCI Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Live Insertion and Capacitance Buffering PCI Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Curves
      6. 9.2.6 Repeater/Bus Extender Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
        3. 9.2.6.3 Application Curves
      7. 9.2.7 Systems With Disparate Supply Voltages
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
        3. 9.2.7.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±8000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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