ZHCS275D July   2010  – January 2023 TCA6424A

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Voltage Translation
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 I2C Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Address
    5. 8.5 Programming
      1. 8.5.1 Power-On Reset
      2. 8.5.2 Reset Input ( RESET)
      3. 8.5.3 Interrupt Output ( INT)
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Writes
        2. 8.5.4.2 Reads
    6. 8.6 Register Maps
      1. 8.6.1 Control Register and Command Byte
      2. 8.6.2 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1 Minimizing ICC When I/Os Control LEDs
    2. 9.2 Power Supply Recommendation
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 支持资源
    3. 10.3 商标
    4. 10.4 静电放电警告
    5. 10.5 术语表
      1.      Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 Revision History

Changes from Revision C (April 2014) to Revision D (January 2023)

  • 删除了对 RSM 封装的所有引用Go
  • 将提到 I2C 的旧术语实例通篇更改为控制器和目标Go
  • Deleted Package thermal impedance from the Absolute Maximum Ratings tableGo
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed Handling Ratings To: ESD Ratings Go
  • Added the Thermal Information tableGo
  • Added the Application and Implementation NOTEGo
  • Added the Detailed Design Procedure sectionGo
  • Added paragraph: "Ramping up the device VCCP" to Power Supply Recommendations Go

Changes from Revision B (September 2010) to Revision C (April 2014)

  • 已删除硬编码的订购信息表Go
  • 更新了文档格式Go

Changes from Revision A (August 2010) to Revision B (September 2010)

  • 已对文档进行修改，将文档状态从预发布更新为量产数据Go
  • 将文档状态从“米6体育平台手机版_好二三四预发布”更改为“量产数据”Go

Changes from Revision * (July 2010) to Revision A (August 2010)

  • Changed Recommended Supply Sequencing and Rates TableGo
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