ZHCS290G September   2009  – June 2018 TCA8418

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2C Interface Timing Requirements
    7. 6.7  Reset Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  Keypad Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Key Events
        1. 8.3.1.1 Key Event Table
        2. 8.3.1.2 General Purpose Input (GPI) Events
        3. 8.3.1.3 Key Event (FIFO) Reading
        4. 8.3.1.4 Key Event Overflow
      2. 8.3.2 Keypad Lock/Unlock
      3. 8.3.3 Keypad Lock Interrupt Mask Timer
      4. 8.3.4 Control-Alt-Delete Support
      5. 8.3.5 Interrupt Output
        1. 8.3.5.1 50 Micro-second Interrupt Configuration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset (POR)
      2. 8.4.2 Powered (Key Scan Mode)
        1. 8.4.2.1 Idle Key Scan Mode
        2. 8.4.2.2 Active Key Scan Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Bus Transactions
        1. 8.5.2.1 Writes
        2. 8.5.2.2 Reads
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
        1. 8.6.2.1  Configuration Register (Address 0x01)
        2. 8.6.2.2  Interrupt Status Register, INT_STAT (Address 0x02)
        3. 8.6.2.3  Key Lock and Event Counter Register, KEY_LCK_EC (Address 0x03)
        4. 8.6.2.4  Key Event Registers (FIFO), KEY_EVENT_A–J (Address 0x04–0x0D)
        5. 8.6.2.5  Keypad Lock1 to Lock2 Timer Register, KP_LCK_TIMER (Address 0x0E)
        6. 8.6.2.6  Unlock1 and Unlock2 Registers, UNLOCK1/2 (Address 0x0F-0x10)
        7. 8.6.2.7  GPIO Interrupt Status Registers, GPIO_INT_STAT1–3 (Address 0x11–0x13)
        8. 8.6.2.8  GPIO Data Status Registers, GPIO_DAT_STAT1–3 (Address 0x14–0x16)
        9. 8.6.2.9  GPIO Data Out Registers, GPIO_DAT_OUT1–3 (Address 0x17–0x19)
        10. 8.6.2.10 GPIO Interrupt Enable Registers, GPIO_INT_EN1–3 (Address 0x1A–0x1C)
        11. 8.6.2.11 Keypad or GPIO Selection Registers, KP_GPIO1–3 (Address 0x1D–0x1F)
        12. 8.6.2.12 GPI Event Mode Registers, GPI_EM1–3 (Address 0x20–0x22)
        13. 8.6.2.13 GPIO Data Direction Registers, GPIO_DIR1–3 (Address 0x23–0x25)
        14. 8.6.2.14 GPIO Edge/Level Detect Registers, GPIO_INT_LVL1–3 (Address 0x26–0x28)
        15. 8.6.2.15 Debounce Disable Registers, DEBOUNCE_DIS1–3 (Address 0x29–0x2B)
        16. 8.6.2.16 GPIO pull-up Disable Register, GPIO_PULL1–3 (Address 0x2C–0x2E)
      3. 8.6.3 CAD Interrupt Errata
        1. 8.6.3.1 Description
        2. 8.6.3.2 System Impact
        3. 8.6.3.3 System Workaround
      4. 8.6.4 Overflow Errata
        1. 8.6.4.1 Description
        2. 8.6.4.2 System Impact
        3. 8.6.4.3 System Workaround
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Ghosting Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing the Hardware Layout
        2. 9.2.2.2 Configuring the Registers
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TCA8418 UNIT
RTW (WQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 38.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.6 °C/W
RθJB Junction-to-board thermal resistance 17.2 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 17.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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