ZHCSDC5B April   2014  – November 2019 TCA9546A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用示意图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Interrupt and Reset Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 RESET Input
      2. 8.4.2 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Control Register
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register Description
      3. 8.6.3 Control Register Definition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 TCA9546A Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TCA9546A UNIT
D PW
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 92.3 122.3 °C/W
RθJCtop Junction-to-case (top) thermal resistance 52.3 56.6
RθJB Junction-to-board thermal resistance 50.1 57.4
ψJT Junction-to-top characterization parameter 17.7 10.9
ψJB Junction-to-board characterization parameter 49.8 66.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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