ZHCSEK9D March   2016  – October 2021 TCAN1042H , TCAN1042HG , TCAN1042HGV , TCAN1042HV

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 Devices with VCC Only (Devices without the "V" Suffix):
        2. 9.3.7.2 Devices with VIO I/O Level Shifting (Devices with "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (April 2017) to Revision D (October 2021)

Changes from Revision B (August 2016) to Revision C (April 2017)

  • 删除了特性 “符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 将特性 从“符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”更改为“符合 ISO 11898-2:2016 和 ISO 11898-5:2007 物理层标准”Go
  • 将“特性”从“所有器件均支持 2Mbps CAN FD..”更改为“所有器件均支持经典 CAN 和 2Mbps CAN FD..”Go
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the Power Rating table Go
  • Changed VSYM in the Driver Electrical Characteristics tableGo
  • Changed VSYM_DC in the Driver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the Receiver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" in the Test Condition of CID in the Receiver Electrical Characteristics tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the Receiver Electrical Characteristics tableGo
  • Added Note 2 and Changed Table 9-2, BUS OUTPUT columnGo

Changes from Revision A (May 2016) to Revision B (August 2016)

  • 添加了器件：TCAN1042、TCAN1042G、TCAN1042GV 和 TCAN1042VGo
  • 将特性 从添加了总线故障保护：±70V 更改为总线故障保护：±58V（非 H 型号）和 ±70V（H 型号）Go
  • 添加了特性 “可采用 SOIC(8) 封装和无引线 VSON(8) 封装...”Go
  • Added new devices to the Device Comparison Table Go
  • Added the DRB package to the Thermal Information table Go
  • Changed the tMODE TYP value From: 1 µs To: 9 µS in the Switching Characteristics tableGo
  • Changed Section 9.4.3 section Go

Changes from Revision * (March 2016) to Revision A (May 2016)
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