ZHCSIP6C August   2019  – October 2024 TCAN1044-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Characteristics
    6. 5.6  Supply Characteristics
    7. 5.7  Dissipation Ratings
    8. 5.8  Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus Short Circuit Current Limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Characteristics

THERMAL METRIC(1)TCAN1044x-Q1UNIT
D (SOIC)DDF (SOT)DRB (VSON)
RΘJAJunction-to-ambient thermal resistance128.1119.949.9℃/W
RΘJC(top)Junction-to-case (top) thermal resistance68.361.858.2℃/W
RΘJBJunction-to-board thermal resistance71.639.723.9℃/W
ΨJTJunction-to-top characterization parameter19.72.11.7℃/W
ΨJBJunction-to-board characterization parameter70.839.523.8℃/W
RΘJC(bot)Junction-to-case (bottom) thermal resistance-–6.4℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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