ZHCSLL0 July   2021 TCAN1046AV-Q1 , TCAN1048AV-Q1

ADVANCE INFORMATION  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4说明(续)
  5. 5Device Comparison
  6. 6Pin Configuration and Functions
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Links
    3. 7.3 接收文档更新通知
    4. 7.4 支持资源
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 术语表
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

Figure 6-1 D Package , 14 Pin SOIC, Top View
Figure 6-2 DMT Package, 14 Pin VSON, Top View
Table 6-1 Pin Functions
Pins Type Description
Name No.
TXD1 1 Digital Input CAN transmit data input 1, integrated pull-up
GND1 2 GND Ground connection
VCC 3 Supply 5-V supply voltage
RXD1 4 Digital Output CAN receive data output 1, tri-state when VIO < UVVIO
GND2 5 GND Ground connection
TXD2 6 Digital Input CAN transmit data input 2, integrated pull-up
RXD2 7 Digital Output CAN receive data output 2, tri-state when VIO < UVVIO
STB2 8 Digital Input Standby input 2 for mode control, integrated pull up (TCAN1046AV–Q1)
nSTB2 Standby input 2 for mode control, inverse logic with integrated pull down (TCAN1048V–Q1)
CANL2 9 Bus IO Low-level CAN bus 2 input/output line
CANH2 10 Bus IO High-level CAN bus 2 input/output line
VIO 11 Supply IO supply voltage
CANL1 12 Bus IO Low-level CAN bus 1 input/output line
CANH1 13 Bus IO High-level CAN bus 1 input/output line
STB1 14 Digital Input Standby input 1 for mode control, integrated pull up (TCAN1046AV–Q1)
nSTB1 Standby input 1 for mode control, inverse logic with integrated pull down (TCAN1048AV–Q1)
Thermal Pad (VSON only) Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief