ZHCSPU9 February   2024 TCAN1465-Q1 , TCAN1469-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Supply Characteristics
    7. 6.7  Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VSUP Pin
      2. 8.3.2  VIO Pin
      3. 8.3.3  VCC Pin
      4. 8.3.4  GND
      5. 8.3.5  INH/LIMP Pin
      6. 8.3.6  WAKE Pin
      7. 8.3.7  TXD Pin
      8. 8.3.8  RXD Pin
      9. 8.3.9  SDO or nINT Interrupt Pin
      10. 8.3.10 nCS Pin
      11. 8.3.11 SCK
      12. 8.3.12 SDI
      13. 8.3.13 CANH and CANL Bus Pins
      14. 8.3.14 CAN FD SIC Transceiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Listen Only Mode
      4. 8.4.4 Sleep Mode
        1. 8.4.4.1 Bus Wake via RXD Request (BWRR) in Sleep Mode
        2. 8.4.4.2 Local Wake Up (LWU) via WAKE Input Terminal
      5. 8.4.5 Selective Wake-up
        1. 8.4.5.1 Selective Wake Mode
        2. 8.4.5.2 Frame Detection
        3. 8.4.5.3 Wake-Up Frame (WUF) Validation
        4. 8.4.5.4 WUF ID Validation
        5. 8.4.5.5 WUF DLC Validation
        6. 8.4.5.6 WUF Data Validation
        7. 8.4.5.7 Frame error counter
        8. 8.4.5.8 CAN FD Frame Tolerance
      6. 8.4.6 Fail-safe Features
        1. 8.4.6.1 Sleep Mode via Sleep Wake Error
        2. 8.4.6.2 Fail-safe Mode
      7. 8.4.7 Protection Features
        1. 8.4.7.1 Driver and Receiver Function
        2. 8.4.7.2 Floating Terminals
        3. 8.4.7.3 TXD Dominant Time Out (DTO)
        4. 8.4.7.4 CAN Bus Short Circuit Current Limiting
        5. 8.4.7.5 Thermal Shutdown
        6. 8.4.7.6 Under-Voltage Lockout (UVLO) and Unpowered Device
          1. 8.4.7.6.1 UVSUP, UVCC
          2. 8.4.7.6.2 UVIO
            1. 8.4.7.6.2.1 Fault Behavior
        7. 8.4.7.7 Watchdog (TCAN1469-Q1)
          1. 8.4.7.7.1 Watchdog Error Counter
          2. 8.4.7.7.2 Watchdog SPI Control Programming
            1. 8.4.7.7.2.1 Watchdog Configuration Registers Lock and Unlock
          3. 8.4.7.7.3 Watchdog Timing
          4. 8.4.7.7.4 Question and Answer Watchdog
            1. 8.4.7.7.4.1 WD Question and Answer Basic Information
            2. 8.4.7.7.4.2 Question and Answer Register and Settings
            3. 8.4.7.7.4.3 WD Question and Answer Value Generation
              1. 8.4.7.7.4.3.1 Answer Comparison
              2. 8.4.7.7.4.3.2 Sequence of the 2-bit Watchdog Answer Counter
            4. 8.4.7.7.4.4 Question and Answer WD Example
              1. 8.4.7.7.4.4.1 Example Configuration for Desired Behavior
              2. 8.4.7.7.4.4.2 Example of Performing a Question and Answer Sequence
      8. 8.4.8 Bus Fault Detection and Communication (TCAN1469-Q1)
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 Chip Select Not (nCS):
        2. 8.5.1.2 SPI Clock Input (SCK):
        3. 8.5.1.3 SPI Serial Data Input (SDI):
        4. 8.5.1.4 SPI Serial Data Output (SDO):
  10. 9 Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Signal Improvement Capable (SIC)
      2. 9.1.2 CAN Termination
        1. 9.1.2.1 Termination
        2. 9.1.2.2 CAN Bus Biasing
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Brownout
      2. 9.2.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Registers
    1. 10.1 Register Maps
      1. 10.1.1  DEVICE_ID_y Register (Address = 0h + formula) [reset = value]
      2. 10.1.2  REV_ID_MAJOR Register (Address = 8h) [reset = 01h]
      3. 10.1.3  REV_ID_MINOR Register (Address = 9h) [reset = 00h]
      4. 10.1.4  SPI_RSVD_x Register (Address = Ah + formula) [reset = 00h]
      5. 10.1.5  Scratch_Pad_SPI Register (Address = Fh) [reset = 00h]
      6. 10.1.6  MODE_CNTRL Register (Address = 10h) [reset = 04h]
      7. 10.1.7  WAKE_PIN_CONFIG Register (Address = 11h) [reset = 4h]
      8. 10.1.8  PIN_CONFIG Register (Address = 12h) [reset = 00h]
      9. 10.1.9  WD_CONFIG_1 Register (Address = 13h) [reset = 15h]
      10. 10.1.10 WD_CONFIG_2 Register (Address = 14h) [reset = 02h]
      11. 10.1.11 WD_INPUT_TRIG Register (Address = 15h) [reset = 00h]
      12. 10.1.12 WD_RST_PULSE Register (Address = 16h) [reset = 07h]
      13. 10.1.13 FSM_CONFIG Register (Address = 17h) [reset = 00h]
      14. 10.1.14 FSM_CNTR Register (Address = 18h) [reset = 00h]
      15. 10.1.15 DEVICE_RST Register (Address = 19h) [reset = 00h]
      16. 10.1.16 DEVICE_CONFIG1 Register (Address = 1Ah) [reset = 00h]
      17. 10.1.17 DEVICE_CONFIG2 Register (Address = 1Bh) [reset = 0h]
      18. 10.1.18 SWE_EN Register (Address 1Ch) [reset = 04h]
      19. 10.1.19 SDO_CONFIG Register (Address = 29h) [reset = 00h]
      20. 10.1.20 WD_QA_CONFIG Register (Address = 2Dh) [reset = 00h]
      21. 10.1.21 WD_QA_ANSWER Register (Address = 2Eh) [reset = 00h]
      22. 10.1.22 WD_QA_QUESTION Register (Address = 2Fh) [reset = 3Ch]
      23. 10.1.23 SW_ID1 Register (Address = 30h) [reset = 00h]
      24. 10.1.24 SW_ID2 Register (Address = 31h) [reset = 00h]
      25. 10.1.25 SW_ID3 Register (Address = 32h) [reset = 00h]
      26. 10.1.26 SW_ID4 Register (Address = 33h) [reset = 00h]
      27. 10.1.27 SW_ID_MASK1 Register (Address = 34h) [reset = 00h]
      28. 10.1.28 SW_ID_MASK2 Register (Address = 35h) [reset = 00h]
      29. 10.1.29 SW_ID_MASK3 Register (Address = 36h) [reset = 00h]
      30. 10.1.30 SW_ID_MASK4 Register (Address = 37h) [reset = 00h]
      31. 10.1.31 SW_ID_MASK_DLC Register (Address = 38h) [reset = 00h]
      32. 10.1.32 DATA_y Register (Address = 39h + formula) [reset = 00h]
      33. 10.1.33 SW_RSVD_y Register (Address = 41h + formula) [reset = 00h]
      34. 10.1.34 SW_CONFIG_1 Register (Address = 44h) [reset = 50h]
      35. 10.1.35 SW_CONFIG_2 Register (Address = 45h) [reset = 00h]
      36. 10.1.36 SW_CONFIG_3 Register (Address = 46h) [reset = 1Fh]
      37. 10.1.37 SW_CONFIG_4 Register (Address = 47h) [reset = 00h]
      38. 10.1.38 SW_CONFIG_RSVD_y Register (Address = 48h + formula) [reset = 00h]
      39. 10.1.39 DEVICE_CONFIGx Register (Address = 4Bh) [reset = 0h]
      40. 10.1.40 INT_GLOBAL Register (Address = 50h) [reset = 00h]
      41. 10.1.41 INT_1 Register (Address = 51h) [reset = 00h]
      42. 10.1.42 INT_2 Register (Address = 52h) [reset = 40h]
      43. 10.1.43 INT_3 Register (Address 53h) [reset = 00h]
      44. 10.1.44 INT_CANBUS Register (Address = 54h) [reset = 00h]
      45. 10.1.45 INT_GLOBAL_ENABLE (Address = 55h) [reset = 00h]
      46. 10.1.46 INT_ENABLE_1 Register (Address = 56h) [reset = FFh]
      47. 10.1.47 INT_ENABLE_2 Register (Address = 57h) [reset = 1Fh]
      48. 10.1.48 INT_ENABLE_3 Register (Address = 58h) [reset = 0h]
      49. 10.1.49 INT_ENABLE_CANBUS Register (Address = 59h) [reset = 7Fh]
      50. 10.1.50 INT_RSVD_y Register (Address = 5Ah + formula) [reset = 00h]
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 CAN Transceiver Physical Layer Standards:
      2. 11.1.2 EMC Requirements:
      3. 11.1.3 Conformance Test Requirements:
      4. 11.1.4 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1) TCAN146x UNIT
D (SOIC) DMT (VSON) DYY(SOT-23)
14-PINS 14-PINS 14-PINS
RθJA Junction-to-ambient thermal resistance 37.5 91.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37.8 33.8 °C/W
RθJB Junction-to-board thermal resistance 13.9 30.6 °C/W
ΨJT Junction-to-top characterization parameter 0.7 0.8 °C/W
ΨJB Junction-to-board characterization parameter 13.9 30.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.7 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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