ZHCSJ74A December   2018  – January 2020 TCAN4550

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图，CLKIN 来自 MCU
      2.      简化原理图，晶振
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC ESD and ISO Transient Specification
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Supply Characteristics
    7. 6.7  Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VSUP Pin
      2. 8.3.2  VIO Pin
      3. 8.3.3  VCCOUT Pin
      4. 8.3.4  GND
      5. 8.3.5  INH Pin
      6. 8.3.6  WAKE Pin
      7. 8.3.7  FLTR Pin
      8. 8.3.8  RST Pin
      9. 8.3.9  OSC1 and OSC2 Pins
      10. 8.3.10 nWKRQ Pin
      11. 8.3.11 nINT Interrupt Pin
      12. 8.3.12 GPO1 Pin
      13. 8.3.13 GPO2 Pin
      14. 8.3.14 CANH and CANL Bus Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Sleep Mode
        1. 8.4.3.1 Bus Wake via RXD_INT Request (BWRR) in Sleep Mode
        2. 8.4.3.2 Local Wake Up (LWU) via WAKE Input Terminal
      4. 8.4.4 Test Mode
      5. 8.4.5 Failsafe Feature
      6. 8.4.6 Protection Features
        1. 8.4.6.1 Watchdog Function
        2. 8.4.6.2 Driver and Receiver Function
        3. 8.4.6.3 Floating Terminals
        4. 8.4.6.4 TXD_INT Dominant Timeout (DTO)
        5. 8.4.6.5 CAN Bus Short Circuit Current Limiting
        6. 8.4.6.6 Thermal Shutdown
        7. 8.4.6.7 Under Voltage Lockout (UVLO) and Unpowered Device
          1. 8.4.6.7.1 UVSUP and UVCCOUT
          2. 8.4.6.7.2 UVIO
          3. 8.4.6.7.3 Fault and M_CAN Core Behavior:
      7. 8.4.7 CAN FD
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 Chip Select Not (nCS):
        2. 8.5.1.2 SPI Clock Input (SCLK):
        3. 8.5.1.3 SPI Data Input (SDI):
        4. 8.5.1.4 SPI Data Output (SDO):
      2. 8.5.2 Register Descriptions
    6. 8.6 Register Maps
      1. 8.6.1 Device ID and Interrupt/Diagnostic Flag Registers: 16'h0000 to 16'h002F
        1. 8.6.1.1 DEVICE_ID1[31:0] (address = h0000) [reset = h4E414354]
          1. Table 10. Device ID Field Descriptions
        2. 8.6.1.2 DEVICE_ID2[31:0] (address = h0004) [reset = h30353534]
          1. Table 11. Device ID Field Descriptions
        3. 8.6.1.3 Revision (address = h0008) [reset = h00110201]
          1. Table 12. Revision Field Descriptions
        4. 8.6.1.4 Status (address = h000C) [reset = h0000000U]
          1. Table 13. Status Field Descriptions
      2. 8.6.2 Device Configuration Registers: 16'h0800 to 16'h08FF
        1. 8.6.2.1 Modes of Operation and Pin Configuration Registers (address = h0800) [reset = hC8000468]
          1. Table 15. Modes of Operation and Pin Configuration Registers Field Descriptions
        2. 8.6.2.2 Timestamp Prescalar (address = h0804) [reset = h00000002]
          1. Table 16. EMC Enhancement and Timestamp Prescalar Field Descriptions
        3. 8.6.2.3 Test Register and Scratch Pad (address = h0808) [reset = h00000000]
          1. Table 17. Test and Scratch Pad Register Field Descriptions
        4. 8.6.2.4 Test Register (address = h080C) [reset = h00000000]
          1. Table 18. Test Register Field Descriptions
      3. 8.6.3 Interrupt/Diagnostic Flag and Enable Flag Registers: 16'h0820/0824 and 16'h0830
        1. 8.6.3.1 Interrupts (address = h0820) [reset = h00100000]
          1. Table 19. Interrupts Field Descriptions
        2. 8.6.3.2 MCAN Interrupts (address = h0824) [reset = h00000000]
          1. Table 20. MCAN Interrupts Field Descriptions
        3. 8.6.3.3 Interrupt Enables (address = h0830 ) [reset = hFFFFFFFF]
          1. Table 21. Interrupt Enables Field Descriptions
      4. 8.6.4 CAN FD Register Set: 16'h1000 to 16'h10FF
        1. 8.6.4.1  Core Release Register (address = h1000) [reset = hrrrddddd]
          1. Table 25. Core Release Register Field Descriptions
        2. 8.6.4.2  Endian Register (address = h1004) [reset = h87654321]
          1. Table 26. Endian Register Field Descriptions
        3. 8.6.4.3  Customer Register (address = h1008) [reset = h00000000]
          1. Table 27. Customer Register Field Descriptions
        4. 8.6.4.4  Data Bit Timing & Prescaler (address = h100C) [reset = h0000A33]
          1. Table 28. Data Bit Timing & Prescaler Field Descriptions
        5. 8.6.4.5  Test Register (address = h1010 ) [reset = h00000000]
          1. Table 29. Test Register Field Descriptions
        6. 8.6.4.6  RAM Watchdog (address = h1014) [reset = h00000000]
          1. Table 30. RAM Watchdog Field Descriptions
        7. 8.6.4.7  Control Register (address = h1018) [reset = 0000 0019]
          1. Table 31. Control Register Field Descriptions
        8. 8.6.4.8  Nominal Bit Timing & Prescaler Register (address = h101C) [reset = h06000A03]
          1. Table 32. Nominal Bit Timing & Prescaler Register Field Descriptions
        9. 8.6.4.9  Timestamp Counter Configuration (address = h1020) [reset = h00000000]
          1. Table 33. Timestamp Counter Configuration Descriptions
        10. 8.6.4.10 Timestamp Counter Value (address = h1024) [reset = h00000000]
          1. Table 34. Timestamp Counter Value Field Descriptions
        11. 8.6.4.11 Timeout Counter Configuration (address = h1028) [reset = hFFFF0000]
          1. Table 35. Timeout Counter Configuration Field Descriptions
        12. 8.6.4.12 Timeout Counter Value (address = h102C) [reset = h0000FFFF]
          1. Table 36. Timeout Counter Value Field Descriptions
        13. 8.6.4.13 Reserved (address = h1030 - h103C) [reset = h00000000]
          1. Table 37. Reserved Field Descriptions
        14. 8.6.4.14 Error Counter Register (address = h1040) [reset = h00000000]
          1. Table 38. Error Counter Register Field Descriptions
        15. 8.6.4.15 Protocol Status Register (address = h1044) [reset = h00000707]
          1. Table 39. Protocol Status Register Field Descriptions
        16. 8.6.4.16 Transmitter Delay Compensation Register (address = h1048) [reset = h00000000]
          1. Table 40. Transmitter Delay Compensation Register Field Descriptions
        17. 8.6.4.17 Reserved (address = h104C) [reset = h00000000]
          1. Table 41. Reserved Field Descriptions
        18. 8.6.4.18 Interrupt Register (address = h1050) [reset = h00000000]
          1. Table 42. Interrupt Register Field Descriptions
        19. 8.6.4.19 Interrupt Enable (address = h1054) [reset = h00000000]
          1. Table 43. Interrupt Enable Field Descriptions
        20. 8.6.4.20 Interrupt Line Select (address = h1058) [reset = h00000000]
          1. Table 44. Interrupt Line Select Field Descriptions
        21. 8.6.4.21 Interrupt Line Enable (address = h105C) [reset = h00000000]
          1. Table 45. Interrupt Line Enable Field Descriptions
        22. 8.6.4.22 Reserved (address = h1060 - h107C) [reset = h00000000]
          1. Table 46. Reserved Field Descriptions
        23. 8.6.4.23 Global Filter Configuration (address = h1080) [reset = h00000000]
          1. Table 47. Global Filter Configuration Field Descriptions
        24. 8.6.4.24 Standard ID Filter Configuration (address = h1084) [reset = h00000000]
          1. Table 48. Standard ID Filter Configuration Field Descriptions
        25. 8.6.4.25 Extended ID Filter Configuration (address = h1088) [reset = h00000000]
          1. Table 49. Extended ID Filter Configuration Field Descriptions
        26. 8.6.4.26 Reserved (address = h108C) [reset = h00000000]
          1. Table 50. Reserved Field Descriptions
        27. 8.6.4.27 Extended ID AND Mask (address = h1090) [reset = h1FFFFFFF]
          1. Table 51. Extended ID AND Mask Field Descriptions
        28. 8.6.4.28 High Priority Message Status (address = h1094) [reset = h00000000]
          1. Table 52. High Priority Message Status Field Descriptions
        29. 8.6.4.29 New Data 1 (address = h1098) [reset = h00000000]
          1. Table 53. New Data 1 Field Descriptions
        30. 8.6.4.30 New Data 2 (address = h109C) [reset = h00000000]
          1. Table 54. New Data 2 Field Descriptions
        31. 8.6.4.31 Rx FIFO 0 Configuration (address = h10A0) [reset = h00000000]
          1. Table 55. Rx FIFO 0 Configuration Field Descriptions
        32. 8.6.4.32 Rx FIFO 0 Status (address = h10A4) [reset = h00000000]
          1. Table 56. Rx FIFO 0 Status Field Descriptions
        33. 8.6.4.33 Rx FIFO 0 Acknowledge (address = h10A8) [reset = h00000000]
          1. Table 57. Rx FIFO 0 Acknowledge Field Descriptions
        34. 8.6.4.34 Rx Buffer Configuration (address = h10AC) [reset = h00000000]
          1. Table 58. Rx Buffer Configuration Field Descriptions
        35. 8.6.4.35 Rx FIFO 1 Configuration (address = h10B0) [reset = h00000000]
          1. Table 59. Rx FIFO 1 Configuration Field Descriptions
        36. 8.6.4.36 Rx FIFO 1 Status (address = h10B4) [reset = h00000000]
          1. Table 60. Rx FIFO 1 Status Field Descriptions
        37. 8.6.4.37 Rx FIFO 1 Acknowledge (address = h10B8) [reset = h00000000]
          1. Table 61. Rx FIFO 1 Acknowledge Field Descriptions
        38. 8.6.4.38 Rx Buffer/FIFO Element Size Configuration (address = h10BC) [reset = h00000000]
          1. Table 62. Rx Buffer/FIFO Element Size Configuration Field Descriptions
        39. 8.6.4.39 Tx Buffer Configuration (address = h10C0) [reset = h00000000]
          1. Table 63. Tx Buffer Configuration Field Descriptions
        40. 8.6.4.40 Tx FIFO/Queue Status (address = h10C4) [reset = h00000000]
          1. Table 64. Tx FIFO/Queue Status Field Descriptions
        41. 8.6.4.41 Tx Buffer Element Size Configuration (address = h10C8) [reset = h00000000]
          1. Table 65. Tx Buffer Element Size Configuration Field Descriptions
        42. 8.6.4.42 Tx Buffer Request Pending (address = h10CC) [reset = h00000000]
          1. Table 66. Tx Buffer Request Pending Field Descriptions
        43. 8.6.4.43 Tx Buffer Add Request (address = h10D0) [reset = h00000000]
          1. Table 67.   Tx Buffer Add Request Field Descriptions
          2. 8.6.4.43.1  Tx Buffer Cancellation Request (address = h10D4 [reset = h00000000]
            1. Table 68. Tx Buffer Cancellation Request Field Descriptions
          3. 8.6.4.43.2  Tx Buffer Add Request Transmission Occurred (address = h10D8) [reset = h00000000]
            1. Table 69. Tx Buffer Add Request Transmission Occurred Field Descriptions
          4. 8.6.4.43.3  Tx Buffer Cancellation Finished (address = h10DC) [reset = h00000000]
            1. Table 70. Tx Buffer Cancellation Finished Field Descriptions
          5. 8.6.4.43.4  Tx Buffer Transmission Interrupt Enable (address = h10E0) [reset = h00000000]
            1. Table 71. Tx Buffer Transmission Interrupt Enable Field Descriptions
          6. 8.6.4.43.5  Tx Buffer Cancellation Finished Interrupt Enable (address = h10E4) [reset = h00000000]
            1. Table 72. Tx Buffer Cancellation Finished Interrupt Enable Field Descriptions
          7. 8.6.4.43.6  Reserved (address = h10E8) [reset = h00000000]
            1. Table 73. Reserved Field Descriptions
          8. 8.6.4.43.7  Reserved (address = h10EC) [reset = h00000000]
            1. Table 74. Reserved Field Descriptions
          9. 8.6.4.43.8  Tx Event FIFO Configuration (address = h10F0) [reset = h00000000]
            1. Table 75. Tx Event FIFO Configuration Field Descriptions
          10. 8.6.4.43.9  Tx Event FIFO Status (address = h10F4) [reset = h00000000]
            1. Table 76. Tx Event FIFO Status Field Descriptions
          11. 8.6.4.43.10 Tx Event FIFO Acknowledge (address = h10F8) [reset = h00000000]
            1. Table 77. Tx Event FIFO Acknowledge Field Descriptions
          12. 8.6.4.43.11 Reserved (address = h10FC) [reset = h00000000]
            1. Table 78. Reserved Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Design Consideration
      1. 9.1.1 Crystal and Clock Input Requirements
      2. 9.1.2 Bus Loading, Length and Number of Nodes
      3. 9.1.3 CAN Termination
        1. 9.1.3.1 Termination
        2. 9.1.3.2 CAN Bus Biasing
      4. 9.1.4 INH Brownout Behavior
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Requirements
      2. 9.2.2 Detailed Design Procedures
      3. 9.2.3 Application Curves
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
        1. 12.1.1.1 CAN 收发器物理层标准：
        2. 12.1.1.2 EMC 要求：
        3. 12.1.1.3 符合性测试要求：
        4. 12.1.1.4 支持文档
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Electrical Characteristics

over operating free-air temperature range for – 40 ℃ ≤ TA ≤ 125 ℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS (1) MIN TYP MAX UNIT
CAN DRIVER ELECTRICAL CHARACTERISTICS
VO(D) Bus output voltage (dominant) CANH See Figure 5 and Figure 6, TXD_INT = 0 V, EN = 0 V, 50 Ω ≤ RL ≤ 65 Ω, CL = open, RCM = open 2.75 4.5 V
Bus output voltage (dominant) CANL 0.5 2.25 V
VO(R) Bus output voltage (recessive) See Figure 3 and Figure 6, TXD_INT = VIO, RL = open (no load), RCM = open 2 2.5 3 V
V(DIFF) Maximum differential voltage rating See Figure 3 and Figure 6 –5.0 10 V
VO(STB) Bus output voltage (Standby Mode) CANH See Figure 3 and Figure 6, TXD_INT = VIO, RL = open (no load), RCM = open –0.1 0.1 V
Bus output voltage (Standby Mode) CANL –0.1 0.1 V
Bus output voltage (Standby Mode) CANH - CANL –0.2 0.2 V
VOD(D) Differential output voltage (dominant) See Figure 3 and Figure 6, TXD_INT = 0 V, 50 Ω ≤ RL ≤ 65 Ω, CL = open, RCM = open 1.5 3 V
See Figure 3 and Figure 6, TXD_INT = 0 V, 45 Ω ≤ RL ≤ 70 Ω, CL = open, RCM = open 1.4 3 V
See Figure 3 and Figure 6, TXD_INT = 0 V, RL = 2.24 kΩ, CL = open, RCM = open 1.5 5 V
VOD(R) Differential output voltage (recessive) See Figure 3 and Figure 6, TXD_INT = VIO, RL = 60 Ω, CL = open, RCM = open –120 12 mV
See Figure 3 and Figure 6, TXD_INT = VIO, RL = open (no load), CL = open, RCM = open –50 50 mV
VSYM Output symmetry (dominant or recessive)
( VO(CANH) + VO(CANL)) / VCC		 See Figure 3 and Figure 6, RL = 60 Ω, CL = open, RCM = open, C1 = 4.7 nF, TXD_INT - 250 kHZ, 1 MHz 0.9 1.1 V/V
VSYM_DC Output symmetry (dominant or recessive) (VCC – VO(CANH) – VO(CANL)) with a frequency that corresponds to the highest bit rate for which the HS-PMA implementation is intended, however, at most 1 MHz (2 Mbit/s) See Figure 3 and Figure 6, RL = 60 Ω, CL = open, RCM = open, C1 = 4.7 nF –300 300 mV
IOS_DOM Short-circuit steady-state output current, dominant See Figure 3 and Figure 10, -3.0 V ≤ VCANH ≤ 18.0 V, CANL = open, TXD_INT = 0 V –100 mA
See Figure 3 and Figure 10, -3.0 V ≤ VCANL ≤+18.0 V, CANH = open, TXD_INT = 0 V 100 mA
IOS_REC Short-circuit steady-state output current, recessive See Figure 3 and Figure 10, – 27 V ≤ VBUS ≤ 32 V, VBUS = CANH = CANL –5 5 mA
CAN RECEIVER ELECTRICAL CHARACTERISTICS
VITdom Receiver dominant state differential input voltage range, bus biasing active -12.0 V ≤ VCANL ≤ +12.0 V
-12.0 V ≤ VCANH ≤ +12.0 V  See Figure 7,  Table 3 		0.9 8 V
VITrec Receiver recessive state differential input voltage range bus biasing active –3.0 0.5 V
VHYS Hysteresis voltage for input-threshold, normal modes See Figure 7, Table 3 120 mV
VIT(ENdom) Receiver dominant state differential input voltage range, bus biasing inactive (VDiff) -12.0 V ≤ VCANL ≤ +12.0 V
-12.0 V ≤ VCANH ≤ +12.0 V See Figure 7,  Table 3 		1.15 8 V
VIT(ENrec) Receiver recessive state differential input voltage range, bus biasing inactive (VDiff) -12.0 V ≤ VCANL ≤ +12.0 V
-12.0 V ≤ VCANH ≤ +12.0 V See Figure 7,  Table 3 		–3 0.4 V
VCM Common mode range: normal See Figure 7, Table 3 –12 12 V
VCM(EN) Common mode range: standby mode See Figure 7, Table 3 –12 12 V
IIOFF(LKG) Power-off (unpowered) bus input leakage current VCANH = VCANL = 5 V, Vsup to GND via 0 Ω and 47 kΩ resistor 5 µA
CI Input capacitance to ground (CANH or CANL) 25 pF
CID Differential input capacitance 14 pF
RID Differential input resistance TXD_INT = VCCINT, normal mode: -2.0 V ≤ VCANH ≤+7.0 V; -2.0 V ≤VCANL ≤ + 7.0 V 60 100 kΩ
RIN Single ended Input resistance (CANH or CANL) -2.0 V ≤ VCANH ≤+7.0 V; -2.0 V ≤VCANL ≤ + 7.0 V 30 50 kΩ
RIN(M) Input resistance matching: [1 – (RIN(CANH) / (RIN(CANL))] × 100% VCANH = VCANL = 5.0 V –1 1 %
VCCOUT 5 V output supply ICCOUT = -70 mA to 0 mA; VSUP = 6 V to 18 V; -40°C < TA < 85°C 4.75 5 5.25 V
VDROP Drop out voltage VCCOUT = 5 V, VSUP = 12 V, ICCOUT = 70 mA 300 500 mV
ΔVCC(ΔVSUP) Line regulation VSUP = 6 V to 24 V, ΔVCCOUT, ICCOUT = 10 mA 50 mV
ΔVCC(ΔVSUPL) Load regulation VSUP = 14 V,   ICCOUT = 1 mA to 70 mA, ΔVCCOUT, –40℃ ≤ TA ≤ 125℃ 60 mV
UVCCOUT Under voltage threshold on VCCOUT 4.2 4.55 V
FLTR TERMINAL
VMEASURE Voltage measured at FLTR pin 1.5 V
C(FLTR) Filter pin capacitor External filter capacitor 300 330 nF
INH OUTPUT TERMINAL (HIGH VOLTAGE OUTPUT)
ΔVH High-level voltage drop INH with respect to VSUP IINH = - 0.5 mA 0.5 1 V
ILKG(INH) Leakage current INH = 0 V, Sleep Mode –0.5 0.7 µA
WAKE INPUT TERMINAL (HIGH VOLTAGE INPUT)
VIH High-level input voltage Standby mode, WAKE pin enabled VSUP–2 V
VIL Low-level input voltage Standby mode, WAKE pin enabled VSUP–3 V
IIH High-level input current WAKE = VSUP–1 V –25 –15 µA
IIL Low-level input current WAKE = 1 V 15 25 µA
tWAKE WAKE filter time Wake up filter time from a wake edge on WAKE; standby, sleep mode 50 µs
SDI, SCK, GPIO1 INPUT TERMINALS
VIH High-level input voltage 0.7 VIO
VIL Low-level input voltage 0.3 VIO
IIH High-level input leakage current Inputs = VIO = 5.25 V –1 1 µA
IIL Low-level input leakage current Inputs = 0 V, VIO = 5.25 V   –100 –5 µA
CIN Input capacitance 18 MHz 10 12 pF
ILKG(OFF) Unpowered leakage current (SDI and SCK only) Inputs = 5.25 V, VIO = VSUP = 0 V –1 1 µA
nCS INPUT TERMINAL
VIH High-level input voltage 0.7  VIO
VIL Low-level input voltage 0.3  VIO
IIH High-level input leakage current nCS = VIO = 5.25 V –1 1 µA
IIL Low-level input leakage current nCS = VIO = 5.25 V –50 –5 µA
ILKG(OFF) Unpowered leakage current nCS = 5.25 V, VIO = VSUP = 0 V –1 1 µA
RST INPUT TERMINAL
VIH High-level input voltage 0.7 VIO
VIL Low-level input voltage 0.3 VIO
IIH High-level input leakage current RST = VIO = 5.25 V 1 10 µA
IIL Low-level input leakage current RST = 0 V –1 1 µA
ILKG(OFF) Unpowered leakage current RST = VIO, VSUP = 0 V –7.5 7.5 µA
tPULSE_WIDTH Width of the input pulse 30 µs
SDO, GPIO1, GPO2 OUTPUT TERMINAL; nINT (OPEN DRAIIN) and nWKRQ (WHEN PROGRAMMED TO WORK OFF OF VIO AND IS OPEN DRAIN)
VOH High-level output voltage 0.8  VIO
VOL Low-level output voltage 0.2  VIO
nWKRQ OUTPUT TERMINAL (DEFAULT INTERNAL VOLTAGE RAIL)
VOH High-level output voltage Default value when based upon internal voltage rail 2.8 3.6 V
VOL Low-level output voltage Default value when based upon internal voltage rail 0.7 V
OSC1 TERMINAL AND CRYSTAL SPECIFICATION
VIH High-level input voltage 0.85 1.10 VIO
VIL Low-level input voltage 0.3 VIO
FOSC1 Clock-In frequency tolerance , see section Crystal and Clock Input Requirements   20 MHz –0.5 0.5 %
FOSC1 Clock-In frequency tolerance, see section Crystal and Clock Input Requirements 40 MHz –0.5 0.5 %
tDC Input duty cycle 45 55 %
ESR Crystal ESR for load capacitance (2) 60 Ω
(1) All TXD_INT, RXD_INT and EN_INT references are for internal nodes that represent the same functions for a physical layer transceiver.
(2) Specified by design
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