Isolated MCU and Main voltage domains enable
an SoC’s MCU and Main processor sub-systems to operate independently. There are 2 reasons an
SoC’s PDN design may need to support independent MCU and Main processor functionality. First
is to provide flexibility to enable SoC low power modes that can significant reduce SoC
power dissipation when processor operations are not needed. Second is to enable robustness
to gain freedom from interference (FFI) of a single fault impacting both MCU and Main
processor sub-systems which is especially beneficial if using the SoC’s MCU as the system
safety monitoring processor. The number of additional PDN power rails needed is dependent
upon number of different MCU IO signaling voltage levels. If only 1.8V IO signaling is used,
then only 2 additional power rails could be required. If both 1.8 and 3.3V IO signaling is
desired, then 4 additional power rails could be needed.
A. T1Time
stamp markers:
- T0 – All 3.3-V voltages start supply
ramp-up to VOPR MIN. (0 ms)
- T1 – All 1.8-V voltages start supply
ramp-up to VOPR MIN. (2 ms)
- T2 – All core voltages start supply
ramp-up to VOPR MIN. (3 ms)
- T3 – All RAM array voltages start
supply ramp-up to VOPR MIN. (4 ms)
- T4 – OSC1 is stable and PORz/MCU_PORz
are de-asserted to release processor from reset. (13 ms)
B. Any MCU or
Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 3.3 V to support
3.3-V digital interfaces. A few supplies could have varying start times between T0 to T1
due to PDN designs using different power resources with varying turn-on & ramp-up time
delays.
C. Any MCU or
Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 1.8 V to support
1.8-V digital interfaces. When eMMC memories are used, Main 1.8-V supplies could have
delayed start times that aligns to T3 due to PDN designs grouping supplies with
VDD_MMC0.
D. VDDSHV5
supports MMC1 signaling for SD memory cards. If compliant UHS-I SD card operation is
needed, then an independent, dual voltage (3.3 V/1.8 V) power source and rail are
required. The start of ramp-up to 3.3 V will be same as other 3.3-V domains as shown. If
SD card is not needed or standard data rates with fixed 3.3-V operation is acceptable,
then supply can be grouped with digital IO 3.3-V power rail. If a SD card is capable of
operating with fixed 1.8 V, then supply can be grouped with digital IO 1.8-V power
rail.
E. VDDA_3P3_USB is 3.3-V analog supply used for USB 2.0 differential interface signaling. A
low noise, analog supply is recommended to provide best signal integrity for USB data eye
mask compliance. The start of ramp-up to 3.3 V will be same as other 3.3-V domains as
shown. If USB interface is not needed or data bit errors can be tolerated, then supply can
be grouped with 3.3-V digital IO power rail either directly or through a supply
filter.
F. VDDA_1P8_<clk/pll/ana> are 1.8-V analog domains supporting clock oscillator, PLL
and analog circuitry needing a low noise supply for optimal performance. It is not
recommended to combine digital VDDSHVn_MCU and VDDSHVn IO domains since high frequency
switching noise could negatively impact jitter performance of clock, PLL and DLL signals.
Combining analog VDDA_1p8_<phy> domains should be avoided but if grouped, then
in-line ferrite bead supply filtering is required.
G. VDDA_1P8_<phy> are 1.8-V analog domains supporting multiple serial PHY interfaces.
A low noise, analog supply is recommended to provide best signal integrity, interface
performance and spec compliance. If any of these interfaces are not needed, data bit
errors or non-compliant operation can be tolerated, then domains can be grouped with
digital IO 1.8-V power rail either directly or through an in-line supply filter is
allowed.
H. VDDA_0P8_<dll/pll> are 0.8-V analog domains supporting PLL and DLL circuitry
needing a low noise supply for optimal performance. It is not recommended to combine these
domains with any other 0.8-V domains since high frequency switching noise could negatively
impact jitter performance of PLL and DLL signals.
I. VDD_MCU is
a digital voltage supply with a wide operational voltage range and power sequencing
flexibility, enabling it to be grouped and ramped-up with either 0.8-V VDD_CORE at time
stamp T2 or 0.85-V RAM array domains (VDDAR_xxx) at time stamp T3.
J. Minimum
set-up and hold times shown with respect to MCU_PORz and PORz asserting high to latch
MCU_BOOTMODEn (referenced to MCU_VDDSHV0) and BOOTMODEn (reference to VDDSHV2) settings
into registers during power up sequence.
K. Minimum
elapsed time from crystal oscillator circuitry being energized (VDDA_OSC1 at T1) until
stable clock frequency is reached depends upon on crystal oscillator, capacitor parameters
and PCB parasitic values. A conservative 10 ms elapsed time defined by (T4 – T1) time
stamps is shown. This could be reduced depending upon customer’s clock circuit (that is,
crystal oscillator or clock generator) and PCB designs.
Figure 7-5 Isolated MCU and
Main Domains, Primary Power-Up Sequence