ZHCSKP3K September   2021  – April 2024 TDA4VM , TDA4VM-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
      2. 5.3.2  DDRSS
        1. 5.3.2.1 MAIN Domain
      3. 5.3.3  GPIO
        1. 5.3.3.1 MAIN Domain
        2. 5.3.3.2 WKUP Domain
      4. 5.3.4  I2C
        1. 5.3.4.1 MAIN Domain
        2. 5.3.4.2 MCU Domain
        3. 5.3.4.3 WKUP Domain
      5. 5.3.5  I3C
        1. 5.3.5.1 MAIN Domain
        2. 5.3.5.2 MCU Domain
      6. 5.3.6  MCAN
        1. 5.3.6.1 MAIN Domain
        2. 5.3.6.2 MCU Domain
      7. 5.3.7  MCSPI
        1. 5.3.7.1 MAIN Domain
        2. 5.3.7.2 MCU Domain
      8. 5.3.8  UART
        1. 5.3.8.1 MAIN Domain
        2. 5.3.8.2 MCU Domain
        3. 5.3.8.3 WKUP Domain
      9. 5.3.9  MDIO
        1. 5.3.9.1 MCU Domain
      10. 5.3.10 CPSW2G
        1. 5.3.10.1 MCU Domain
      11. 5.3.11 CPSW9G
        1. 5.3.11.1 MAIN Domain
      12. 5.3.12 ECAP
        1. 5.3.12.1 MAIN Domain
      13. 5.3.13 EQEP
        1. 5.3.13.1 MAIN Domain
      14. 5.3.14 EHRPWM
        1. 5.3.14.1 MAIN Domain
      15. 5.3.15 USB
        1. 5.3.15.1 MAIN Domain
      16. 5.3.16 SERDES
        1. 5.3.16.1 MAIN Domain
      17. 5.3.17 OSPI
        1. 5.3.17.1 MCU Domain
      18. 5.3.18 Hyperbus
        1. 5.3.18.1 MCU Domain
      19. 5.3.19 GPMC
        1. 5.3.19.1 MAIN Domain
      20. 5.3.20 MMC
        1. 5.3.20.1 MAIN Domain
      21. 5.3.21 CPTS
        1. 5.3.21.1 MCU Domain
        2. 5.3.21.2 MAIN Domain
      22. 5.3.22 UFS
        1. 5.3.22.1 MAIN Domain
      23. 5.3.23 PRU_ICSSG [Currently Not Supported]
        1. 5.3.23.1 MAIN Domain
      24. 5.3.24 MCASP
        1. 5.3.24.1 MAIN Domain
      25. 5.3.25 DSS
        1. 5.3.25.1 MAIN Domain
      26. 5.3.26 DP
        1. 5.3.26.1 MAIN Domain
      27. 5.3.27 Camera Streaming Interface Receiver (CSI_RX_IF) Subsystem
        1. 5.3.27.1 MAIN Domain
      28. 5.3.28 DSI_TX
        1. 5.3.28.1 MAIN Domain
      29. 5.3.29 VPFE
        1. 5.3.29.1 MAIN Domain
      30. 5.3.30 DMTIMER
        1. 5.3.30.1 MAIN Domain
        2. 5.3.30.2 MCU Domain
      31. 5.3.31 Emulation and Debug
        1. 5.3.31.1 MAIN Domain
      32. 5.3.32 System and Miscellaneous
        1. 5.3.32.1 Boot Mode Configuration
          1. 5.3.32.1.1 MAIN Domain
          2. 5.3.32.1.2 MCU Domain
        2. 5.3.32.2 Clock
          1. 5.3.32.2.1 MAIN Domain
          2. 5.3.32.2.2 WKUP Domain
        3. 5.3.32.3 System
          1. 5.3.32.3.1 MAIN Domain
          2. 5.3.32.3.2 WKUP Domain
        4. 5.3.32.4 EFUSE
      33. 5.3.33 Power Supply
    4. 5.4 Pin Multiplexing
    5. 5.5 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Power-On-Hour (POH) Limits
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
    6. 6.6 Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for ALF Package
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Sequencing
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 Combined MCU and Main Domains Power-Up Sequencing
        3. 6.9.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 6.9.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 6.9.2.5 Isolated MCU and Main Domains, Primary Power- Down Sequencing
        6. 6.9.2.6 Entry and Exit of MCU Only State
        7. 6.9.2.7 Entry and Exit of DDR Retention State
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Timing
        2. 6.9.3.2 Safety Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input and Output Clocks / Oscillators
          1. 6.9.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.9.4.1.1.1 Load Capacitance
            2. 6.9.4.1.1.2 Shunt Capacitance
          2. 6.9.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.9.4.1.3.1 Load Capacitance
            2. 6.9.4.1.3.2 Shunt Capacitance
          4. 6.9.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 Auxiliary OSC1 Not Used
          6. 6.9.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
          7. 6.9.4.1.7 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Module and Peripheral Clocks Frequencies
      5. 6.9.5 Peripherals
        1. 6.9.5.1  ATL
          1. 6.9.5.1.1 ATL_PCLK Timing Requirements
          2. 6.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.9.5.2  VPFE
        3. 6.9.5.3  CPSW2G
          1. 6.9.5.3.1 CPSW2G MDIO Interface Timings
          2. 6.9.5.3.2 CPSW2G RMII Timings
            1. 6.9.5.3.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.9.5.3.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.9.5.3.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.9.5.3.3 CPSW2G RGMII Timings
            1. 6.9.5.3.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.9.5.3.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.9.5.3.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.9.5.3.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        4. 6.9.5.4  CPSW9G
          1. 6.9.5.4.1 CPSW9G MDIO Interface Timings
          2. 6.9.5.4.2 CPSW9G RMII Timings
            1. 6.9.5.4.2.1 RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.9.5.4.2.2 RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.9.5.4.2.3 RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics – RMII Mode
          3. 6.9.5.4.3 CPSW9G RGMII Timings
            1. 6.9.5.4.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.9.5.4.3.2 RGMII[x]_RD[3:0] and RGMII[x]_RCTL Timing Requirements – RGMII Mode
            3. 6.9.5.4.3.3 RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.9.5.4.3.4 RGMII[x]_TD[3:0] and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        5. 6.9.5.5  CSI-2
        6. 6.9.5.6  DDRSS
        7. 6.9.5.7  DSS
        8. 6.9.5.8  eCAP
          1. 6.9.5.8.1 Timing Requirements for eCAP
          2. 6.9.5.8.2 Switching Characteristics for eCAP
        9. 6.9.5.9  EPWM
          1. 6.9.5.9.1 Switching Characteristics for eHRPWM
          2. 6.9.5.9.2 Timing Requirements for eHRPWM
        10. 6.9.5.10 eQEP
          1. 6.9.5.10.1 Timing Requirements for eQEP
          2. 6.9.5.10.2 Switching Characteristics for eQEP
        11. 6.9.5.11 GPIO
          1. 6.9.5.11.1 GPIO Timing Requirements
          2. 6.9.5.11.2 GPIO Switching Characteristics
        12. 6.9.5.12 GPMC
          1. 6.9.5.12.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.9.5.12.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.9.5.12.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.9.5.12.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.9.5.12.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.9.5.12.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.9.5.12.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.9.5.12.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.9.5.12.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.9.5.12.4 GPMC0 IOSET
        13. 6.9.5.13 HyperBus
          1. 6.9.5.13.1 Timing Requirements for HyperBus
          2. 6.9.5.13.2 HyperBus 166 MHz Switching Characteristics
          3. 6.9.5.13.3 HyperBus 100 MHz Switching Characteristics
        14. 6.9.5.14 I2C
        15. 6.9.5.15 I3C
        16. 6.9.5.16 MCAN
        17. 6.9.5.17 MCASP
        18. 6.9.5.18 MCSPI
          1. 6.9.5.18.1 MCSPI — Master Mode
          2. 6.9.5.18.2 MCSPI — Slave Mode
        19. 6.9.5.19 MMCSD
          1. 6.9.5.19.1 MMC0 - eMMC Interface
            1. 6.9.5.19.1.1 Legacy SDR Mode
            2. 6.9.5.19.1.2 High Speed SDR Mode
            3. 6.9.5.19.1.3 High Speed DDR Mode
            4. 6.9.5.19.1.4 HS200 Mode
          2. 6.9.5.19.2 MMC1/2 - SD/SDIO Interface
            1. 6.9.5.19.2.1 Default Speed Mode
            2. 6.9.5.19.2.2 High Speed Mode
            3. 6.9.5.19.2.3 UHS–I SDR12 Mode
            4. 6.9.5.19.2.4 UHS–I SDR25 Mode
            5. 6.9.5.19.2.5 UHS–I SDR50 Mode
            6. 6.9.5.19.2.6 UHS–I DDR50 Mode
            7. 6.9.5.19.2.7 UHS–I SDR104 Mode
        20. 6.9.5.20 CPTS
          1. 6.9.5.20.1 CPTS Timing Requirements
          2. 6.9.5.20.2 CPTS Switching Characteristics
        21. 6.9.5.21 OSPI
          1. 6.9.5.21.1 OSPI PHY Mode
            1. 6.9.5.21.1.1 OSPI With Data Training
              1. 6.9.5.21.1.1.1 OSPI Switching Characteristics – Data Training
            2. 6.9.5.21.1.2 OSPI Without Data Training
              1. 6.9.5.21.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.9.5.21.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.9.5.21.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.9.5.21.1.2.4 OSPI Switching Characteristics – DDR Mode
          2. 6.9.5.21.2 OSPI Tap Mode
            1. 6.9.5.21.2.1 OSPI Tap SDR Timing
            2. 6.9.5.21.2.2 OSPI Tap DDR Timing
        22. 6.9.5.22 PCIE
        23. 6.9.5.23 Timers
          1. 6.9.5.23.1 Timing Requirements for Timers
          2. 6.9.5.23.2 Switching Characteristics for Timers
        24. 6.9.5.24 UART
          1. 6.9.5.24.1 Timing Requirements for UART
          2. 6.9.5.24.2 UART Switching Characteristics
        25. 6.9.5.25 USB
      6. 6.9.6 Emulation and Debug
        1. 6.9.6.1 Trace
        2. 6.9.6.2 JTAG
          1. 6.9.6.2.1 JTAG Electrical Data and Timing
            1. 6.9.6.2.1.1 JTAG Timing Requirements
            2. 6.9.6.2.1.2 JTAG Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A72
      2. 7.2.2 Arm Cortex-R5F
      3. 7.2.3 DSP C71x
      4. 7.2.4 DSP C66x
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 GPU
      2. 7.3.2 VPAC
      3. 7.3.3 DMPAC
      4. 7.3.4 D5520MP2
      5. 7.3.5 VXE384MP2
    4. 7.4 Other Subsystems
      1. 7.4.1 MSMC
      2. 7.4.2 NAVSS
        1. 7.4.2.1 NAVSS0
        2. 7.4.2.2 MCU_NAVSS
      3. 7.4.3 PDMA Controller
      4. 7.4.4 Power Supply
      5. 7.4.5 Peripherals
        1. 7.4.5.1  ADC
        2. 7.4.5.2  ATL
        3. 7.4.5.3  CSI
          1. 7.4.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 7.4.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 7.4.5.4  CPSW2G
        5. 7.4.5.5  CPSW9G
        6. 7.4.5.6  DCC
        7. 7.4.5.7  DDRSS
        8. 7.4.5.8  DSS
          1. 7.4.5.8.1 DSI
          2. 7.4.5.8.2 eDP
        9. 7.4.5.9  VPFE
        10. 7.4.5.10 eCAP
        11. 7.4.5.11 EPWM
        12. 7.4.5.12 ELM
        13. 7.4.5.13 ESM
        14. 7.4.5.14 eQEP
        15. 7.4.5.15 GPIO
        16. 7.4.5.16 GPMC
        17. 7.4.5.17 Hyperbus
        18. 7.4.5.18 I2C
        19. 7.4.5.19 I3C
        20. 7.4.5.20 MCAN
        21. 7.4.5.21 MCASP
        22. 7.4.5.22 MCRC Controller
        23. 7.4.5.23 MCSPI
        24. 7.4.5.24 MMC/SD
        25. 7.4.5.25 OSPI
        26. 7.4.5.26 PCIE
        27. 7.4.5.27 SerDes
        28. 7.4.5.28 WWDT
        29. 7.4.5.29 Timers
        30. 7.4.5.30 UART
        31. 7.4.5.31 USB
        32. 7.4.5.32 UFS
  9. 8 Applications and Implementation
    1. 8.1 Power Supply Mapping
    2. 8.2 Device Connection and Layout Fundamentals
      1. 8.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.2.1.1 Power Distribution Network Implementation Guidance
      2. 8.2.2 External Oscillator
      3. 8.2.3 JTAG and EMU
      4. 8.2.4 Reset
      5. 8.2.5 Unused Pins
      6. 8.2.6 Hardware Design Guide for JacintoTM 7 Devices
    3. 8.3 Peripheral- and Interface-Specific Design Information
      1. 8.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 8.3.2.1 No Loopback and Internal Pad Loopback
        2. 8.3.2.2 External Board Loopback
        3. 8.3.2.3 DQS (only available in Octal Flash devices)
      3. 8.3.3 SERDES REFCLK Design Guidelines
      4. 8.3.4 USB VBUS Design Guidelines
      5. 8.3.5 System Power Supply Monitor Design Guidelines
      6. 8.3.6 High Speed Differential Signal Routing Guidance
      7. 8.3.7 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALF|827
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.1 Power Supply Mapping

This Jacinto 7TM processor device can be operated in several different modes of operation depending upon the number of power resources, power supply groups (i.e. power rails) and control signals available:

  • Full Active
  • MCU Only low power mode
  • DDR Retention (Suspend-to-RAM or S2R) low power mode
  • MCU Island safety monitor
  • Extended MCU safety monitor

Two power distribution networks (PDNs) that support these different operational modes are recommended and provide optional end product features. To name a few:

  • Dual Voltage (1.8V & 3.3V) IO Interfaces
  • Compliant UHS-I SD Card
  • Compliant USB2.0
  • High Security device type Efuse programming on-board for in-field updates

An Isolated PDN provides independent MCU & Main power resources & rails (see Table 8-2) to support power rail Freedom From Interference (FFI) as desired to reach end product system functional safety targets. An isolated PDN is needed to support MCU Only lower power mode or MCU Island safety monitoring. MCU ONLY can significantly reduce device power by disabling all Main processing while only keeping MCU processor resources active. A Combined PDN reduces total number of power resources & rails by grouping MCU & Main supplies into common power rails (see Table 8-1). This PDN can be used for Extended MCU safety processing but does not allow for MCU Island safety monitor or MCU Only low power modes. The DDR Retention low power mode can be supported with either an Isolated or Combined PDN scheme.

The TPS6594x & LP8764x Power Management ICs (PMICs) are key power components in the two recommended PDNs. Additional discrete power components may be added as desired to support optional system features. TI has optimized recommended PDNs using these PMICs for the following reasons:

  • Full device performance entitlement as validated on TI Evalution boards
  • Enable all system functional safety features and analysis captured in device safety manual
  • Support power rail load steps, supply voltage accuracies and maximum load currents with margins
  • Meet device primary & low power mode supply sequencing requirements (refer to Section 6.9.2, Power Supply Sequencing)
  • Provide Adaptive Voltage Scaling (AVS) Class 0 device requirements with TI validated software

For full PDN design and operational details, refer to either

  1. “Dual TPS6594-Q1 PMIC User Guide for Jacinto 7TM DRA829 and TDA4VM Automotived PDN-0B (SLVUC32)” for legacy designs aligned to original EVM PDN-0A wishing to minimize SCH & PCB updates
  2. “Dual TPS6594-Q1 PMIC User Guide for Jacinto 7TM DRA829 and TDA4VM Automotived PDN-0C (SLVUC99)" for all new designs

Table 8-1 Combined MCU and Main Voltage Domain Power Rail Mapping
TYPES VOLTAGE [V] DOMAIN NAMES DOMAIN GROUPS POWER RAILS #
Digital IO 3.3 (VDDSHV0_MCU, VDDSHV1_MCU, VDDSHV2_MCU, VDDSHV0,VDDSHV1, VDDSHV2, VDDSHV3, VDDSHV4, VDDSHV53, VDDSHV6)1, VDDA_3P3_USB4 VDDSHVn_MCU,VDDSHVn, VDDA_3P3_USB4 VDD_IO_3V3 1
Digital IO 1.8 (VDDSHV0_MCU, VDDSHV1_MCU, VDDSHV2_MCU, VDDSHV0, VDDSHV1, VDDSHV2, VDDSHV, VDDSHV4, VDDSHV53, VDDSHV6)2 VDDSHVn_MCU2 VDDSHVn32 VDD_IO_1V8 2
Digital IO 1.8 VDDS_MMC06 VDDS_MMC06 VDDS_MMC0_1V86 3
Analog PHY 1.8 (VDDA_1P8_CSIRX, VDDA_1P8_USB, VDDA_1P8_UFS, VDDA_1P8_DP, VDDA_1P8_DSITX, VDDA_1P8_MLB, VDDA_1P8_SERDES) VDDA_1P8_<phy>5 VDD_PHY_1V85 4
Analog Clk, Meas 1.8 VDDA_MCU_PLLGRP0, VDDA_MCU_TEMP, VDDA_ADC_MCU, VDDA_POR_WKUP, VDDA_WKUP VDDS_OSC1, VDDA_PLLGRP6:0, VDDA_TEMP3:0 VDDA_1P8_<clk/meas> VDA_LN_1V8 5
Analog, low voltage 0.80 VDDA_0P8_PLL_MLB, VDDA_0P8_PLL_DDR, VDDA_0P8_DLL_MMC0 VDDA_0P8_DPLL VDA_DPLL_0V8 6
Digital, AVS low voltage 0.77 – 0.84 VDD_CPU VDD_CPU VDD_CPU_AVS 7
Digital, low voltage 0.80 VDD_MCU7, VDD_CORE, (VDDA_0P8_SERDES, VDDA_0P8_SERDES_C, VDDA_0P8_DP, VDDA_0P8_DP_C, VDDA_0P8_DSITX, VDDA_0P8_DSITX_C, VDDA_0P8_CSIRX, VDDA_0P8_UFS, VDDA_0P8_USB) 8 VDD_MCU

VDD_CORE

VDDA_0P8_<phy>8		 VDD_PROC_0V8 8
Digital, low voltage 0.85

VDDAR_MCU,

VDDAR_CORE,

VDDAR_CPU		 VDDAR VDD_RAM_0V85 9
Digital, low voltage 1.1 VDDS_DDR_BIAS,

VDDS_DDR,

VDDS_DDR_C		 VDDS_DDR VDD_DDR_1V1 10
  1. Any MCU or Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 3.3V to support 3.3V digital interfaces
  2. Any MCU or Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 1.8V to support 1.8V digital interfaces
  3. VDDSHV5 supports MMC1 signaling for SD memory cards. A dual voltage (3.3/1.8V) power rail is required for compliant, high-speed SD card operations. If SD card is not needed or standard data rates with fixed 3.3V operation is acceptable, then domain can be grouped with digital IO 3.3V power rail. If a SD card is capable of operating with fixed 1.8V, then domain can be grouped with digital IO 1.8V power rail.
  4. VDDA_3P3_USB is 3.3V analog domain used for USB 2.0 differential interface signaling. A low noise, analog supply is recommended to provide best signal integrity for USB data eye mask compliance. If USB interface is not needed or data bit errors can be tolerated, then domain can be grouped with 3.3V digital IO power rail either directly or through a supply filter.
  5. VDDA_1P8_<phy> are 1.8V analog domains supporting multiple serial PHY interfaces. A low noise, analog supply is recommended to provide best signal integrity, interface performance and spec compliance. If any of these interfaces are not needed, data bit errors or non-compliant operation can be tolerated, then domains can be grouped with digital IO 1.8V power rail either directly or through an in-line supply filter is allowed.
  6. VDD_MMC0 is 1.8V digital supply supporting MMC0 signaling for eMMC interface. If MMC0 or eMMC0 interface is not needed, then domain can be grouped with digital IO 1.8V power rail. However, if MMC0 interface is needed, then VDD_MMC0 must not start ramp-up until VDD_CORE has reached Vopr min.
  7. VDD_MCU is a digital voltage supply with a wide operational voltage range and power sequencing flexibility, enabling it to be grouped and ramped-up with either 0.8V VDD_CORE or 0.85V RAM array domains (VDDAR_xxx).
  8. VDDA_1P8_<clk/pll/ana> are 1.8V analog domains supporting clock oscillator, PLL and analog circuitry needing a low noise supply for optimal performance.
Table 8-2 Isolated MCU and Main Voltage Domain Power Rail Mapping
TYPES VOLTAGE [V] DOMAIN NAMES DOMAIN GROUPS POWER RAILS #
Digital IO 3.3 (VDDSHV0_MCU, VDDSHV1_MCU, VDDSHV2_MCU)1 VDDSHVn_MCU VDD_MCUIO_3V3 1
Digital IO 3.3 (VDDSHV0, VDDSHV1, VDDSHV2, VDDSHV3, VDDSHV4, VDDSHV53, VDDSHV6)1, VDDA_3P3_USB4 VDDSHVn, VDDA_3P3_USB4 VDD_IO_3V3 2
Digital IO 1.8 (VDDSHV0_MCU, VDDSHV1_MCU, VDDSHV2_MCU)2 VDDSHVn_MCU2 VDD_MCUIO_1V8 3
Digital IO 1.8 (VDDSHV0, VDDSHV1, VDDSHV2, VDDSHV3, VDDSHV4, VDDSHV53, VDDSHV6)2 VDDSHVn23 VDD_IO_1V8 4
Digital IO 1.8 VDDS_MMC06 VDDS_MMC06 VDDS_MMC0_1V86 5
Analog Clk, Meas 1.8 VDDA_MCU_PLLGRP0, VDDA_MCU_TEMP, VDDA_ADC_MCU, VDDA_POR_WKUP, VDDA_WKUP VDDA_MCU1P8_<clk/meas> VDA_MCU_1V8 6
Analog Clk, Meas 1.8 VDDS_OSC1, VDDA_PLLGRP6:0, VDDA_TEMP3:0 VDDA_1P8_<clk/meas> VDA_DPLL_1V8 7
Analog PHY 1.8 (VDDA_1P8_CSIRX, VDDA_1P8_USB, VDDA_1P8_UFS, VDDA_1P8_DP, VDDA_1P8_DSITX, VDDA_1P8_MLB, VDDA_1P8_SERDES)5 VDDA_1P8_<phy>5 VDA_PHY_1V85 8
Analog, low voltage 0.80 VDDA_0P8_PLL_MLB, VDDA_0P8_PLL_DDR, VDDA_0P8_DLL_MMC0 VDDA_0P8_DPLL VDA_DPLL_0V8 9
Digital, low voltage 0.80 VDD_MCU, VDDAR_MCU VDD_MCU, VDDAR_MCU VDD_MCU_0V85 10
Digital, AVS low voltage 0.77 – 0.84 vdd_cpu VDD_CPU VDD_CPU_AVS 11
Digital, low voltage 0.80 VDD_CORE, (VDDA_0P8_SERDES, VDDA_0P8_SERDES_C, VDDA_0P8_DP, VDDA_0P8_DP_C, VDDA_0P8_DSITX, VDDA_0P8_DSITX_C, VDDA_0P8_CSIRX, VDDA_0P8_UFS, VDDA_0P8_USB)8 VDD_CORE, VDDA_0P8_<phy>8 VDD_CORE_0V8 12
Digital, low voltage 0.85 VDDAR_CORE, VDDAR_CPU VDDAR VDD_RAM_0V85 13
Digital, low voltage 1.1 VDDS_DDR_BIAS,VDDS_DDR, VDDS_DDR_C VDDS_DDR VDD_DDR_1V1 14
  1. Any MCU or Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 3.3V to support 3.3V digital interfaces
  2. Any MCU or Main dual voltage IO supplies (VDDSHVn_MCU or VDDSHVn) being supplied by 1.8V to support 1.8V digital interfaces
  3. VDDSHV5 supports MMC1 signaling for SD memory cards. A dual voltage (3.3/1.8V) power rail is required for compliant, high-speed SD card operations. If SD card is not needed or standard data rates with fixed 3.3V operation is acceptable, then domain can be grouped with digital IO 3.3V power rail. If a SD card is capable of operating with fixed 1.8V, then domain can be grouped with digital IO 1.8V power rail.
  4. VDDA_3P3_USB is 3.3V analog domain used for USB 2.0 differential interface signaling. A low noise, analog supply is recommended to provide best signal integrity for USB data eye mask compliance. If USB interface is not needed or data bit errors can be tolerated, then domain can be grouped with 3.3V digital IO power rail either directly or through a supply filter.
  5. VDDA_1P8_<phy> are 1.8V analog domains supporting multiple serial PHY interfaces. A low noise, analog supply is recommended to provide best signal integrity, interface performance and spec compliance. If any of these interfaces are not needed, data bit errors or non-compliant operation can be tolerated, then domains can be grouped with digital IO 1.8V power rail either directly or through an in-line supply filter is allowed.
  6. VDD_MMC0 is 1.8V digital supply supporting MMC0 signaling for eMMC interface. If MMC0 or eMMC0 interface is not needed, then domain can be grouped with digital IO 1.8V power rail. However, if MMC0 interface is needed, then VDD_MMC0 must not start ramp-up until VDD_CORE has reached VOPR MIN.
  7. VDD_MCU is a digital voltage supply with a wide operational voltage range and power sequencing flexibility, enabling it to be grouped and ramped-up with either 0.8V VDD_CORE or 0.85V RAM array domains (VDDAR_xxx).
  8. VDDA_1P8_<clk/pll/ana> are 1.8V analog domains supporting clock oscillator, PLL and analog circuitry needing a low noise supply for optimal performance.
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