ZHCSFY1F December   2016  – April 2024 TDP158

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply
    6. 5.6  Electrical Characteristics, Differential Input
    7. 5.7  Electrical Characteristics, TMDS Differential Output
    8. 5.8  Electrical Characteristics, DDC, I2C, HPD, and ARC
    9. 5.9  Electrical Characteristics, TMDS Differential Output in DP-Mode
    10. 5.10 Switching Characteristics, TMDS
    11. 5.11 Switching Characteristics, HPD
    12. 5.12 Switching Characteristics, DDC and I2C
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reset Implementation
      2. 7.3.2  Operation Timing
      3. 7.3.3  Lane Control
      4. 7.3.4  Swap
      5. 7.3.5  Main Link Inputs
      6. 7.3.6  Receiver Equalizer
      7. 7.3.7  Input Signal Detect Block
      8. 7.3.8  Transmitter Impedance Control
      9. 7.3.9  TMDS Outputs
      10. 7.3.10 Slew Rate Control
      11. 7.3.11 Pre-Emphasis
      12. 7.3.12 DP-Mode Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 DDC Training for HDMI 2.0 Data Rate Monitor
      2. 7.4.2 DDC Functional Description
    5. 7.5 Register Maps
      1. 7.5.1  Local I2C Control BIT Access TAG Convention
      2. 7.5.2  BIT Access Tag Conventions
      3. 7.5.3  CSR Bit Field Definitions, DEVICE_ID (address = 00h≅07h)
      4. 7.5.4  CSR Bit Field Definitions, REV_ID (address = 08h )
      5. 7.5.5  CSR Bit Field Definitions – MISC CONTROL 09h (address = 09h)
      6. 7.5.6  CSR Bit Field Definitions – MISC CONTROL 0Ah (address = 0Ah)
      7. 7.5.7  CSR Bit Field Definitions – MISC CONTROL 0Bh (address = 0Bh)
      8. 7.5.8  CSR Bit Field Definitions – MISC CONTROL 0Ch (address = 0Ch)
      9. 7.5.9  CSR Bit Field Definitions, Equalization Control Register (address = 0Dh)
      10. 7.5.10 CSR Bit Field Definitions, POWER MODE STATUS (address = 20h)
      11. 7.5.11 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 30h)
      12. 7.5.12 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 31h)
      13. 7.5.13 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 32h)
      14. 7.5.14 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 33h)
      15. 7.5.15 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 34h)
      16. 7.5.16 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 35h)
      17. 7.5.17 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Dh)
      18. 7.5.18 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Eh)
      19. 7.5.19 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Fh)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source Side
        2. 8.2.2.2 DDC Pull Up Resistors
      3. 8.2.3 Application Curves
      4. 8.2.4 Application with DDC Snoop
        1. 8.2.4.1 Source Side HDMI Application
      5. 8.2.5 9.1.2 Source Side HDMI /DP Application Using DP-Mode
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Management
      2. 8.3.2 Standby Power
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
VCCSupply Voltage Nominal Value 3.3V for DP mode33.6V
Supply Voltage Nominal Value 3.3V for HDMI mode3.133.47V
VDDSupply Voltage Nominal Value 1.1V11.27V
TJJunction temperature0105°C
TAOperating free-air temperature (TDP158)085°C
MAIN LINK DIFFERENTIAL PINS
VID(EYE)Peak-to-peak input differential voltage See Figure 6-14751200mV
VID(DC)The input differential voltage Peak-to peak DC level, See Figure 6-142001200mV
VICInput Common Mode Voltage (Internally Biased)0.50.9V
dRData rate0.256Gbps
VSADJTMDS compliant swing voltage bias resistor (Nominal 6kΩ for HDMI and DP combination; 6.49kΩ for HDMI only)(1)4.58kΩ
DDC, I2C, HPD, AND CONTROL PINS
VI(DC)DC Input VoltageHDP_SNK, SDA_SNK, SCL_SNK,–0.35.5V
SDA_SRC, SCL_SRC; All other Local I2C, and control pins–0.33.6V
VILLow-level input voltage at DDC0.3 x VCCV
Low-level input voltage at HPD0.8V
Low-level input voltage at SDA_CTL/PRE, OE, A1/EQ2, A0/EQ1, TERM, I2C_EN, SLEW, SCL_CTL/SWAP pins only0.3V
VIMMid-Level input voltage at A1/EQ2, A0/EQ1, TERM, SLEW pins only1.21.6V
VIHHigh-level input voltage at OE, A1/EQ2, A0/EQ1, TERM, I2C_EN, SLEW pins only0.7 x VCCV
High-level input voltage at SDA_SRC, SCL_SRC, SDA_CTL/PRE, SCL_CTL/SWAP0.7 x VCCV
High-level input voltage at SDA_SNK, SCL_SNK3.2V
High-level input voltage at HPD2V
VOLLow-level output voltage0.4V
VOHHigh-level output voltage2.4V
fSCLSCL clock frequency fast I2C mode for local I2C control400kHz
C(bus,DDC)Total capacitive load for each bus line supporting 400kHz (DDC terminals)400pF
C(bus,I2C)Total capacitive load for each bus line (local I2C terminals)100pF
dR(DDC)DDC Data rate400Kbps
IIHHigh level input current–3030µA
IIMMid level input current–2020µA
IILLow level input current–1010µA
IOZHigh impedance output current10µA
R(OEPU)Pull up resistance on OE pin150250kΩ
(1) Reducing resistor in VSADJ will increase VOD, care should be taking since resistors below ≅6kΩ may lead to compliance failures.
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