ZHCSAH8B November 2012 – March 2022 TFP401A-Q1
PRODUCTION DATA
The TFP401A-Q1 device comes in TI's thermally enhanced PowerPAD 100-TQFP package. The PowerPAD package is a 14-mm × 14-mm × 1-mm TQFP outline with 0.5-mm lead pitch. The PowerPAD package has a specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline. The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to the die mount pad for enhanced thermal conduction. There is no thermal requirement for soldering the back side of the TFP401A-Q1 device to the application board, because the device power dissipation is well within the package capability when not soldered. However, to minimize stress on peripheral pins, it is highly recommended to solder the thermal pad to PCB.
Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations. Because the die pad is electrically connected to the chip substrate and hence to chip ground, connection of the PowerPAD's back side to a PCB ground plane helps to improve EMI, ground bounce, and power-supply noise performance.
Table 8-2 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-PowerPAD package is included only for reference.
| PARAMETER | WITHOUT PowerPAD™ PACKAGE | PowerPAD™ PACKAGE, NOT CONNECTED TO PCB THERMAL PLANE | PowerPAD™ PACKAGE, CONNECTED TO PCB THERMAL PLANE(1) |
|---|---|---|---|
| Theta-JA(1) (2) | 45°C/W | 27.3°C/W | 17.3°C/W |
| Theta-JC(1)(2) | 3.11°C/W | 0.12°C/W | 0.12°C/W |
| Maximum power dissipation(1)(2)(3) | 1.6 W | 2.7 W | 4.3 W |