ZHCSQB3A january 2023 – july 2023 THS2630
PRODUCTION DATA
| THERMAL METRIC(1) | THS2630 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | DGN (HVSSOP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 126.3 | 147.3 | 57.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67.3 | 37.9 | 76.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 69.8 | 83.2 | 30.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.5 | 0.9 | 4.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 69.0 | 81.6 | 29.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 14.3 | °C/W |