ZHCSHX6C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.7 Typical Characteristics: ±15 V

at +VS = 15 V, –VS = –15 V, TA ≅ 25°C, RLOAD = 100 Ω to midsupply, noninverting gain (G) = 5 V/V. RGT package : RF = 576 Ω, RG = 143 Ω, or DDA package: RF = 798 Ω, RG = 200 Ω (unless otherwise noted)

GUID-0CBF8DFC-1381-4067-820B-D0CDB60592F2-low.gif
VO = 2 VPPRGT package
Figure 8-1 Noninverting Small-Signal Frequency Response
GUID-C346C0AD-3E37-4EB5-9044-85A15C118443-low.gif
VO = 2 VPP
Figure 8-3 Inverting Small-Signal Frequency Response
GUID-76751227-1E3F-44AC-BF36-B3F099785C4E-low.gif
RGT package; see Figure 10-1 for setup information
Figure 8-5 Frequency Response vs CLOAD
GUID-AFB2EA34-A029-4B4B-88E9-271237F06E77-low.gif
DDA package
Figure 8-7 HD2 vs Frequency
GUID-7196807A-2CCE-4F1A-B75A-9217E3BF9F85-low.gif
VO = 2 VPPRGT package
Figure 8-9 HD2 vs Frequency
GUID-311FFD80-4198-48BC-AC06-2B63EDB1640A-low.gif
Figure 8-11 HD2 vs Frequency Across Output Swing
GUID-A7C748F1-59B5-4F97-8F99-63E612A5A0EE-low.gif
Figure 8-13 HD2 vs Output Swing
GUID-8A2853EF-E8B6-48AB-8B78-C52F60EF447F-low.gif
VO = 2 VPP
Figure 8-15 HD2 vs Frequency Across Temperature
GUID-47271500-2C8E-4407-90C3-3A1C20E721F5-low.gif
VO = 2 VPPRLoad = 1 kΩ
Figure 8-17 Harmonic Distortion vs Frequency
GUID-32CE1B5D-8ACE-49E0-BF12-D398BD69263A-low.gif
±100-kHz frequency spacing
Figure 8-19 IMD2 vs Output Voltage Swing
GUID-F6FE7AC0-B2EE-4648-8D1D-0F5247F764F8-low.gif
Figure 8-21 Spot Input Noise vs Frequency
GUID-53E63E4B-45A2-419C-821C-B992FB7BE08D-low.gif
VO = 10 VPP
Figure 8-23 G = 5 V/V Pulse Response
GUID-29CA86DF-9235-46EE-BE19-7117B0876B10-low.gif
VO = 10 VPP
Figure 8-25 G = –5 V/V Pulse Response
GUID-48FD393F-49DB-49AA-9846-E4A90C89CA33-low.gif
Figure 8-27 Output Impedance vs Frequency
GUID-D21BEBB7-3604-43E6-8699-255D89C8A8AA-low.gif
VIN = 2 VPP
Figure 8-29 Shutdown Feedthrough vs Frequency
GUID-004E0854-EF74-4304-A7F0-FBED9D86507C-low.gif
A. Measured with devices soldered on TI EVM. Devices not turned off at any read points but load applied for a few milliseconds to measure VOUT and then removed.
Figure 8-31 Output Voltage Swing vs Output Current
GUID-88C3053B-F5A3-4C75-AAD0-9A1A433D5833-low.gif
7100 units at each supply
Figure 8-33 Inverting IB Distribution
GUID-C013F038-2367-493D-9193-6F5DBE87BFFD-low.gif
Flash tested to keep TJ as close to TA as possible
Figure 8-35 Input Offset Voltage Over Temperature
GUID-5CE66A1B-8F73-478F-9950-79D40284AF05-low.gif
Flash tested to keep TJ as close to TA as possible
Figure 8-37 Noninverting IB Over Temperature
GUID-0840F66F-009D-457E-83F4-F145C4C14A00-low.gif
90 units at each supply
Figure 8-39 Inverting IB Drift Histogram
GUID-9DA08327-8F8A-4DA7-B513-D4953145A8D2-low.gif
Device in shutdown mode to minimize self-heating, RGT package
Figure 8-41 TJ_SENSE Voltage vs Ambient Temperature
GUID-02F3A63C-021A-423F-A5F1-4448D11ABE21-low.gif
VO = 2 VPPDDA package
Figure 8-2 Noninverting Small-Signal Frequency Response
GUID-AC5E4392-70C5-45B9-AF81-07DEB3E328AA-low.gif
RGT package; see Section 9.4.4 section for more details
Figure 8-4 Frequency Response vs Output Swing
GUID-AF4183EB-E866-4D1C-A90A-02FBD2AC6D6A-low.gif
VO = 2 VPPRGT package
Figure 8-6 Frequency Response vs Temperature
GUID-2C1467E7-186B-497B-9063-290060D717C1-low.gif
DDA package
Figure 8-8 HD3 vs Frequency
GUID-272140B8-4321-4C7C-83A5-19D889BC6750-low.gif
VO = 2 VPPRGT package
Figure 8-10 HD3 vs Frequency
GUID-5F84AB9C-9AC4-435C-B49E-63D1E61BF03B-low.gif
Figure 8-12 HD3 vs Frequency Across Output Swing
GUID-8811E3E3-B558-4448-832D-84776EE0C6FD-low.gif
Figure 8-14 HD3 vs Output Swing
GUID-73F8A29C-3B8C-47D7-BDBE-CA62BE25438B-low.gif
VO = 2 VPP
Figure 8-16 HD3 vs Frequency Across Temperature
GUID-755B3EC2-FD1D-4C12-9CB7-ADAB0F6AC538-low.gif
VO = 5 VPP per tone±100-kHz frequency spacing
Figure 8-18 Intermodulation Distortion vs Frequency
GUID-20579BB6-5E4C-41B2-96B9-4B87FFA5697B-low.gif
±100-kHz frequency spacing
Figure 8-20 IMD3 vs Output Voltage Swing
GUID-5EEDE061-CDDF-4A9B-8C20-475C8CB9D841-low.gif
No load
Figure 8-22 Open-Loop Transimpedance Gain and Phase vs Frequency
GUID-E11E83D7-F6B3-45B9-9B99-11CE73AED085-low.gif
VO = 20 VPP
Figure 8-24 G = 5 V/V Pulse Response
GUID-E369B668-35FA-4CBD-B667-E584E0CF7C59-low.gif
VO = 20 VPP
Figure 8-26 G = –5 V/V Pulse Response
GUID-CBE1FFA3-760A-4549-A207-88DCAD10DC09-low.gif
Figure 8-28 Overdrive Recovery Time
GUID-94C11EF0-987D-4D7B-AC20-F5205B3F35FD-low.gif
Figure 8-30 Quiescent Current vs Supply Voltage
GUID-00AE2178-51A9-4810-83AE-62DF35147CFC-low.gif
7100 units at each supply
Figure 8-32 Input Offset Voltage Distribution
GUID-7402D8DB-52F3-4829-83D8-5F8E3E3010CC-low.gif
7100 units at each supply
Figure 8-34 Noninverting IB Distribution
GUID-55866E51-4C61-4864-A60D-B59242020D84-low.gif
Flash tested to keep TJ as close to TA as possible
Figure 8-36 Inverting IB Over Temperature
GUID-EBE02540-0EAE-4D18-81EF-080788773E17-low.gif
90 units at each supply
Figure 8-38 Input Offset Voltage Drift Histogram
GUID-A78E21A6-3705-4905-A584-D34A9AF3ED7B-low.gif
90 units at each supply
Figure 8-40 Noninverting IB Drift Histogram
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