ZHCSOD5L April 2000 – August 2023 THS4130 , THS4131
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- DGN|8
订购信息
6 Pin Configuration and Functions
Figure 6-1 D Package, 8-Pin SOIC, DGK Package, 8-pin VSSOP,
DGN Package, 8-Pin HVSSOP
THS4130 (Top View)
Figure 6-2 D Package, 8-Pin SOIC, DGK Package, 8-pin VSSOP,
DGN Package, 8-Pin HVSSOP
THS4131 (Top View)
Table 6-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | NO. | |||
| THS4130 | THS4131 | |||
| NC | — | 7 | — | No connect |
| PD | 7 | — | I | Active low power-down pin |
| VCC+ | 3 | 3 | I/O | Positive supply voltage pin |
| VCC– | 6 | 6 | I/O | Negative supply voltage pin |
| VIN– | 1 | 1 | I | Negative input pin |
| VOCM | 2 | 2 | I | Common mode input pin |
| VOUT+ | 4 | 4 | O | Positive output pin |
| VOUT– | 5 | 5 | O | Negative output pin |
| VIN+ | 8 | 8 | I | Positive input pin |
| Thermal Pad | Thermal Pad | Thermal Pad | __ | Thermal pad. DGN (HVSSOP) package only. For the best thermal performance, connect the thermal pad to a large copper plane. This pad is electrically isolated from the die so the pad can be connected to any pin on the package. |
(1) I = input, O = output.