The THS413x devices are designed to operate on power supplies ranging from ±2.5 V to ±15 V (single-ended supplies of 5 V to 30 V). Use a power-supply accuracy of 5% or better. When operated on a board with high-speed digital signals, make sure to provide isolation between digital signal noise and the analog input pins. The THS413x are connected to power supplies through pin 3 (V_CC+) and pin 6 (V_CC-). Decouple each supply pin to GND as close to the device as possible with a low-inductance, surface-mount ceramic capacitor of approximately 10 nF. When vias are used to connect the bypass capacitors to a ground plane, configure the vias for minimal parasitic inductance. One method of reducing via inductance is to use multiple vias. For broadband systems, two capacitors per supply pin are advised.

To avoid undesirable signal transients, do not power on the THS413x with large inputs signals present. Careful planning of system power on sequencing is especially important to avoid damage to ADC inputs when an ADC is used in the application.