SLOS432B April   2004  – October 2015 THS4281

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, VS = 3 V (VS+ = 3 V, VS- = GND)
    6. 6.6 Electrical Characteristics, VS = 5 V (VS+ = 5 V, VS- = GND)
    7. 6.7 Electrical Characteristics, VS = ±5 V
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 High-Speed Operational Amplifiers
    2. 7.2 Feature Description
      1. 7.2.1 Wideband, Noninverting Operation
      2. 7.2.2 Wideband, Inverting Operation
    3. 7.3 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single-Supply Operation
      2. 8.1.2 Driving Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Active Filtering With the THS4281
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Decoupling Techniques and Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DBV|5
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from A Revision (November 2009) to B Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed the Packaging/Ordering Information table Go
  • Removed Design Tools section Go
  • Updated Thermal Values Go
  • Removed the Applications Section Contents section Go
  • Removed the Bill of Materials section Go

Changes from * Revision (April 2004) to A Revision

  • Updated document format to current standardsGo
  • Deleted Lead temperature specification from Absolute Maximum Ratings tableGo
  • Revised Driving Capacitive Loads sectionGo
  • Changed Board Layout section; revised statements in fourth recommendation about how to make connections to other wideband devices on the boardGo
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