ZHCSFB6D April   2016  – June 2021 THS4551

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 描述
  4. 4 Revision History
  5. 5 Companion Devices
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: (VS+) – (VS–) = 5 V
    6. 7.6 Electrical Characteristics: (VS+) – (VS–) = 3 V
    7. 7.7 Typical Characteristics: (VS+) – (VS–) = 5 V
    8. 7.8 Typical Characteristics: (VS+) – (VS–) = 3 V
    9. 7.9 Typical Characteristics: 3-V to 5-V Supply Range
  8. 8 Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
    2. 8.2 Output Interface Circuit for DC-Coupled Differential Testing
    3. 8.3 Output Common-Mode Measurements
    4. 8.4 Differential Amplifier Noise Measurements
    5. 8.5 Balanced Split-Supply Versus Single-Supply Characterization
    6. 8.6 Simulated Characterization Curves
    7. 8.7 Terminology and Application Assumptions
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential Open-Loop Gain and Output Impedance
      2. 9.3.2 Setting Resistor Values Versus Gain
      3. 9.3.3 I/O Headroom Considerations
      4. 9.3.4 Output DC Error and Drift Calculations and the Effect of Resistor Imbalances
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 9.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversions
        2. 9.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversions
      2. 9.4.2 Operation from a Differential Input to a Differential Output
        1. 9.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
        2. 9.4.2.2 DC-Coupled, Differential-Input to Differential-Output Design Issues
      3. 9.4.3 Input Overdrive Performance
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Noise Analysis
      2. 10.1.2 Factors Influencing Harmonic Distortion
      3. 10.1.3 Driving Capacitive Loads
      4. 10.1.4 Interfacing to High-Performance Precision ADCs
      5. 10.1.5 Operating the Power Shutdown Feature
      6. 10.1.6 Designing Attenuators
      7. 10.1.7 The Effect of Adding a Feedback Capacitor
    2. 10.2 Typical Applications
      1. 10.2.1 An MFB Filter Driving an ADC Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Differential Transimpedance Output to a High-Grade Audio PCM DAC Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 ADC3k Driver with a 2nd-Order RLC Interstage Filter Application
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Analysis
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Board Layout Recommendations
    2. 12.2 Layout Example
    3. 12.3 EVM Board
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 TINA-TI Simulation Model Features
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

GUID-B8BE31C1-39F6-49EE-B748-5D51994C82DC-low.gifFigure 6-1 DGK Package8-Pin VSSOPTop View
GUID-4E007D21-812F-4F28-9B5C-0D18854924E9-low.gifFigure 6-2 RUN Package10-Pin WQFN Top View
GUID-AFA829E6-206D-4487-9721-B07600A502B7-low.gif Figure 6-3 RGT Package16-Pin VQFN With Exposed Thermal PadTop View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
RGT(1) RUN DGK
FB– 1 — — O Inverting (negative) output feedback
FB+ 4 — — O Noninverting (positive) output feedback
IN– 3 6 1 I Inverting (negative) amplifier input
IN+ 2 4 8 I Noninverting (positive) amplifier input
NC — 2, 8 — — No internal connection
OUT– 11 1 5 O Inverting (negative) amplifier output
OUT+ 10 9 4 O Noninverting (positive) amplifier output
PD 12 3 7 I Power down. PD = logic low = power off mode; PD = logic high = normal operation.
VOCM 9 7 2 I Common-mode voltage input
VS– 13-16 5 6 I Negative power-supply input
VS+ 5, 6, 7, 8 10 3 I Positive power-supply input
(1) Solder the exposed thermal pad (RGT package) to a heat-spreading power or ground plane. This pad is electrically isolated from the die, but it must be connected to a power or ground plane and not floated.
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