ZHCSJZ2F August   2019  – December 2024 THS6222

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 12 V
    6. 5.6 Electrical Characteristics VS = 32 V
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics: VS = 12 V
    9. 5.9 Typical Characteristics: VS = 32 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Common-Mode Buffer
      2. 6.3.2 Thermal Protection and Package Power Dissipation
      3. 6.3.3 Output Voltage and Current Drive
      4. 6.3.4 Breakdown Supply Voltage
      5. 6.3.5 Surge Test Results
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Broadband PLC Line Driving
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Best Design Practices
      1. 7.3.1 Do
      2. 7.3.2 Do Not
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Wafer and Die Information
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YS|0
  • RGT|16
  • RHF|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision E (October 2024) to Revision F (December 2024)

  • 在应用 中为 SEO 的 PLC 标准添加了说明Go
  • 在说明 中为 SEO 的 PLC 标准添加了说明Go
  • 更新了首页上的功能方框图 以及图 6-5、6-7、7-1、7-2 和 7-5 以修复错误的引脚交换和标签Go

Changes from Revision D (April 2021) to Revision E (October 2024)

  • 更新了最后一个特性 要点，以阐明与 THS6212 的兼容性Go
  • Deleted maximum junction temperature continuous operation, long-term reliability from Absolute Maximum Ratings Go
  • Updated drop-in replacement text in Overview sectionGo

Changes from Revision C (November 2020) to Revision D (April 2021)

  • Updated the wrong pin diagram image that was tagged incorrectly during system migrationGo

Changes from Revision B (April 2020) to Revision C (November 2020)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 向器件信息 表中添加了 VQFN (16) 封装Go
  • Updated the RHF package in the Pin Configuration and Functions sectionGo
  • Added the RGT package in the Pin Configuration and Functions sectionGo

Changes from Revision A (December 2019) to Revision B (April 2020)

  • 向器件信息 表添加了晶圆销售封装和本体尺寸（标称值）Go
  • Added the YS die bondpad and functionsGo
  • Updated Table 1 BIAS-1 and BIAS-2 Logic TableGo
  • Added Wafer and Die Information sectionGo

Changes from Revision * (August 2019) to Revision A (December 2019)

  • 将器件状态从预告信息更改为生产数据Go
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