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ZHCSNY7 September 2023 THVD1330

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		THVD1330	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	116.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	56.3	°C/W
R_θJB	Junction-to-board thermal resistance	63.4	°C/W
ψ_JT	Junction-to-top characterization parameter	8.8	°C/W
ψ_JB	Junction-to-board characterization parameter	62.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.