ZHCSJ05C November 2018 – March 2019 THVD1419 , THVD1429
PRODUCTION DATA.
THERMAL METRIC(1) | THVD14x9 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8-PINS | |||
RθJA | Junction-to-ambient thermal resistance | 120.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 50.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 62.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 7.5 | °C/W |
ΨJB | Junction-to-board characterization parameter | 62.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |