米6体育平台手机版

ZHCSGQ1C September 2017 – December 2018 THVD1510 , THVD1512 , THVD1550 , THVD1551 , THVD1552

PRODUCTION DATA.

请参考 PDF 数据表获取器件具体的封装图。

THERMAL METRIC⁽¹⁾		THVD1510 THVD1550	THVD1552	THVD1510 THVD1550 THVD1551	THVD1512 THVD1552	UNIT
		D (SOIC)	D (SOIC)	DGK (VSSOP)	DGS (VSSOP)
		8 PINS	14 PINS	8 PINS	10 PINS
R_θJA	Junction-to-ambient thermal resistance	112.4	88.0	151.7	151.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	62.7	45.4	62.8	59.3	°C/W
R_θJB	Junction-to-board thermal resistance	62.0	44.1	81.3	81.6	°C/W
ψ_JT	Junction-to-top characterization parameter	15.4	11.3	7.8	6.5	°C/W
ψ_JB	Junction-to-board characterization parameter	61.3	43.7	79.8	79.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.