ZHCSSR6B August   2023  – April 2024 THVD4431

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 RS-485 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length for RS-485
        2. 8.2.1.2 Stub Length for RS-485 Network
        3. 8.2.1.3 Bus Loading for RS-485 Network
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information

THERMAL METRIC(1) THVD4431 UNIT
RHA (QFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 27.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.8 °C/W
RθJB Junction-to-board thermal resistance 9.8 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 9.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.7 °C/W
(1) For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application report.
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