ZHCSGQ0A
September 2017 – February 2022
TIC10024-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
VS Pin
8.3.2
VDD Pin
8.3.3
Device Initialization
8.3.4
Device Trigger
8.3.5
Device Reset
8.3.5.1
VS Supply POR
8.3.5.2
Hardware Reset
8.3.5.3
Software Reset
8.3.6
VS Under-Voltage (UV) Condition
8.3.7
VS Over-Voltage (OV) Condition
8.3.8
Switch Inputs Settings
8.3.8.1
Input Current Source and Sink Selection
8.3.8.2
Input Enable Selection
8.3.8.3
Thresholds Adjustment
8.3.8.4
Wetting Current Configuration
8.3.9
Interrupt Generation and INT Assertion
8.3.9.1
INT Pin Assertion Scheme
8.3.9.2
Interrupt Idle Time (tINT_IDLE) Time
8.3.9.3
Microcontroller Wake-Up
8.3.9.4
Interrupt Enable / Disable And Interrupt Generation Conditions
8.3.9.5
Detection Filter
8.3.10
Temperature Monitor
8.3.10.1
Temperature Warning (TW)
8.3.10.2
Temperature Shutdown (TSD)
8.3.11
Parity Check And Parity Generation
8.3.12
Cyclic Redundancy Check (CRC)
8.4
Device Functional Modes
8.4.1
Continuous Mode
8.4.2
Polling Mode
8.4.3
Additional Features
8.4.3.1
Clean Current Polling (CCP)
8.4.3.2
Wetting Current Auto-Scaling
9
Programming
9.1
SPI Communication Interface Buses
9.1.1
Chip Select ( CS)
9.1.2
System Clock (SCLK)
9.1.3
Slave In (SI)
9.1.4
Slave Out (SO)
9.2
SPI Sequence
9.2.1
Read Operation
9.2.2
Write Operation
9.2.3
Status Flag
9.3
Programming Guidelines
9.4
Register Maps
10
Application and Implementation
10.1
Application Information
10.2
Digital Switch Detection in Automotive Body Control Module
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Systems Examples
10.3.1
Using TIC10024-Q1 in a 12 V Automotive System
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Receiving Notification of Documentation Updates
13.2
Community Resources
13.3
Trademarks
14
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
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散热焊盘机械数据 (封装 | 引脚)
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订购信息
zhcsgq0a_oa
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9.1
SPI Communication Interface Buses
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