ZHCSGP5C August   2017  – February 2022 TIC12400-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Mode Selection
        3. 8.3.8.3 Input Enable Selection
        4. 8.3.8.4 Thresholds Adjustment
        5. 8.3.8.5 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable or Disable and Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check and Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
        1. 8.4.2.1 Standard Polling
        2. 8.4.2.2 Matrix polling
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
        3. 8.4.3.3 VS Measurement
        4. 8.4.3.4 Wetting Current Diagnostic
        5. 8.4.3.5 ADC Self-Diagnostic
    5. 8.5 Programming
      1. 8.5.1 SPI Communication Interface Buses
        1. 8.5.1.1 Chip Select ( CS)
        2. 8.5.1.2 System Clock (SCLK)
        3. 8.5.1.3 Slave In (SI)
        4. 8.5.1.4 Slave Out (SO)
      2. 8.5.2 SPI Sequence
        1. 8.5.2.1 Read Operation
        2. 8.5.2.2 Write Operation
        3. 8.5.2.3 Status Flag
    6. 8.6 Register Maps
    7. 8.7 Programming Guidelines
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Using TIC12400-Q1 in a 12 V Automotive System
    3. 9.3 Resistor-coded Switches Detection in Automotive Body Control Module
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Timing Requirements

VS= 4.5 V to 35 V, VDD= 3 V to 5.5 V, and 10 pF capacitive load on SO unless otherwise noted; verified by design and characterization.
PARAMETERTEST CONDITIONMINNOMMAXUNIT
SWITCH MONITORING, INTERRUPT, STARTUP AND RESET
tPOLL_ACTPolling active time accuracyPolling mode-12%12%
tPOLL_ACT_MPolling active time accuracy for matrix inputsPolling mode with matrix enabled-12%12%
tPOLLPolling time accuracyPolling mode-12%12%
tCOMPComparator detection time18µs
tADCADC Conversion timeSample and hold time included24µs
tCCP_TRANTransition time between last input sampling and start of clean current20µs
tCCP_ACTClean current active time-12%12%
tSTARTUPPolling startup time200300400µs
tINT_ACTIVEActive INT assertion duration1.522.5ms
tINT_INACTIVEINT de-assertion duration during a pending interrupt345ms
tINT_IDLEInterrupt idle time80100120µs
tRESETTime required to keep the RESET pin high to successfully reset the device (no pending interrupt)(1)2µs
tREACTDelay between a fault event (OV, UV, TW, or TSD) to a high to low transition on the INT pinSee Figure 7-2 for OV example.20µs
SPI INTERFACE
tLEADFalling edge of CS to rising edge of SCLK setup time100ns
tLAGFalling edge of SCLK to rising edge of CS setup time100ns
tSUSI to SCLK falling edge setup time30ns
tHOLDSI hold time after falling edge of SCLK20ns
tVALIDTime from rising edge of SCLK to valid SO data70ns
tSO(EN)Time from falling edge of CS to SO low-impedance60ns
tSO(DIS)Time from rising edge of CS to SO high-impedanceLoading of 1 kΩ to GND. See Figure 7-3.60ns
tRSI, CS, and SCLK signals rise time530ns
tFSI, CS, and SCLK signals fall time530ns
tINTER_FRAMEDelay between two SPI communication ( CS low) sequences1.5µs
tCKHSCLK High time120ns
tCKLSCLK Low time120ns
tINITIATIONDelay between valid VDD voltage and initial SPI communication45µs
(1) If there is a pending interrupt (/INT pin asserted low), it can take up to 1ms for the device to complete the reset.
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