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ZHCSGF4D July 2017 – June 2019 TIOL111 , TIOL1113 , TIOL1115

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TIOL111(x)	UNIT
THERMAL METRIC⁽¹⁾		DMW (10 Pins)	UNIT
R_θJA	Junction-to-ambient thermal resistance	68.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	60.1	°C/W
R_θJB	Junction-to-board thermal resistance	40.6	°C/W
ψ_JT	Junction-to-top characterization parameter	13.4	°C/W
ψ_JB	Junction-to-board characterization parameter	40.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	25.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.