ZHCSLJ5D February   2022  – March 2023 TIOL112 , TIOL1123 , TIOL1125

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up Detection
      2. 8.3.2  Current Limit Configuration
      3. 8.3.3  Current Fault Detection, Indication and Auto Recovery
      4. 8.3.4  Thermal Warning, Thermal Shutdown
      5. 8.3.5  Fault Reporting (NFAULT)
      6. 8.3.6  Transceiver Function Tables
      7. 8.3.7  The Integrated Voltage Regulator (LDO)
      8. 8.3.8  Reverse Polarity Protection
      9. 8.3.9  Integrated Surge Protection and Transient Waveform Tolerance
      10. 8.3.10 Power Up Sequence (TIOL112)
      11. 8.3.11 Undervoltage Lock-Out (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 NPN Configuration (N-Switch SIO Mode)
      2. 8.4.2 PNP Configuration (P-Switch SIO Mode)
      3. 8.4.3 Push-Pull, Communication Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Junction Temperature Check
        2. 9.2.2.2 Driving Capacitive Loads
        3. 9.2.2.3 Driving Inductive Loads
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (January 2023) to Revision D (March 2023)

  • Added the package outline and land pattern images for the YAH (DSBGA) 12-pin packageGo

Changes from Revision B (December 2022) to Revision C (January 2023)

  • 删除了器件信息 表中 DSBGA 封装的预告信息 注释Go

Changes from Revision A (April 2022) to Revision B (December 2022)

  • Removed the conditional note 2 from the IEC Ratings - ESD Specifications table that specified 4.5kV when EN=TX=HIGH Go
  • Changed the description of I(VCC_OUT) from: (TIOL112L only) to: TIOL1123(L), TIOL1125 only in the Recommended Operating Conditions tableGo
  • Changed Figure 6-4 and Figure 6-6 Go
  • Added application curves Figure 9-6 and Figure 9-7 showing inductive load demagnetizationGo

Changes from Revision * (February 2022) to Revision A (April 2022)

  • 删除了器件信息 表中 VSON 封装的 TIOL112 和 TIOL1125 预告信息 注释Go
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