米6体育平台手机版

ZHCSLJ5D February 2022 – March 2023 TIOL112 , TIOL1123 , TIOL1125

PRODUCTION DATA

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		TIOL112, TIOL1123, TIOL1125	TIOL112, TIOL1123L	UNIT
THERMAL METRIC⁽¹⁾		DRC (10 Pins)	YAH (12 Pins)	UNIT
R_θJA	Junction-to-ambient thermal resistance	45.9	79.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	45.9	0.3	°C/W
R_θJB	Junction-to-board thermal resistance	17.9	19.5	°C/W
ψ_JT	Junction-to-top characterization parameter	0.7	0.1	°C/W
ψ_JB	Junction-to-board characterization parameter	17.8	19.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.7	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.