| THERMAL METRIC(1) |
TL062 |
UNIT |
| D (SOIC) |
P (PDIP) |
PS (SO) |
PW (TSSOP) |
FK (LCCC) |
JG (CDIP) |
| 8 PINS |
8 PINS |
8 PINS |
8 PINS |
20 PINS |
8 PINS |
| RθJA |
Junction-to-ambient thermal resistance(2)(3) |
97 |
85 |
95 |
149 |
— |
— |
°C/W |
| RθJC(top) |
Junction-to-case (top) thermal resistance(4)(5) |
— |
— |
— |
— |
5.61 |
14.5 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with MIL-STD-883.