ZHCSMO4N February 1977 – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC (1) | TL082xx | UNIT | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| D (SOIC) |
DDF (SOT-23) |
FK (LCCC) |
JG (CDIP) |
P (PDIP) |
PS (SO) |
PW (TSSOP) |
U (CFP) |
|||
| 8 PINS | 8 PINS | 20 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 147.8 | 181.5 | – | – | 85 | 95 | 200.3 | 169.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 88.2 | 112.5 | 5.61 | 15.05 | – | – | 89.4 | 62.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 91.4 | 98.2 | – | – | – | – | 131.0 | 176.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 36.8 | 17.2 | – | – | – | – | 22.2 | 48.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 90.6 | 97.6 | – | – | – | – | 129.3 | 144.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | – | – | – | – | N/A | 5.4 | °C/W |