ZHCSMO4N February 1977 – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H
PRODUCTION DATA
| THERMAL METRIC (1) | TL081xx | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) |
DCK (SC70) |
DBV (SOT-23) |
P (PDIP) |
PS (SO) |
|||
| 8 PINS | 5 PINS | 5 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 158.8 | 217.5 | 212.2 | 85 | 95 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 98.6 | 113.1 | 111.1 | – | – | °C/W |
| RθJB | Junction-to-board thermal resistance | 102.3 | 63.8 | 79.4 | – | – | °C/W |
| ψJT | Junction-to-top characterization parameter | 45.8 | 34.8 | 51.8 | – | – | °C/W |
| ψJB | Junction-to-board characterization parameter | 101.5 | 63.5 | 79.0 | – | – | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | °C/W |