ZHCSMO4N February 1977 – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC (1) | TL084xx | UNIT | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| D (SOIC) |
DYY (SOT-23) |
FK (TSSOP) |
J (TSSOP) |
N (TSSOP) |
NS (TSSOP) |
PW (TSSOP) |
W (TSSOP) |
|||
| 14 PINS | 14 PINS | 20 PINS | 14 PINS | 14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.2 | 153.2 | – | – | 80 | 76 | – | 128.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 70.3 | 88.7 | 5.61 | 14.5 | – | – | 14.5 | 56.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 70.2 | 65.4 | – | – | – | – | – | 127.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 28.8 | 9.5 | – | – | – | – | – | 29 | °C/W |
| ψJB | Junction-to-board characterization parameter | 69.8 | 65.0 | – | – | – | – | – | 106.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | – | – | – | – | – | 0.5 | °C/W |