ZHCSS29R April 2004 – April 2024 TL103W , TL103WA , TL103WB
PRODUCTION DATA
| THERMAL METRIC(1) | TL103Wx | UNIT | ||
|---|---|---|---|---|
| SOIC (D) | SOT-23 (DDF) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 135.4 | 170.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 77.3 | 89.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 78.9 | 87.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 27.4 | 7.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 78.1 | 87.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | °C/W |