ZHCSKJ6 December   2019 TL16C750E

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     方框图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. 7.1      ESD Ratings
    3. Table 2. Recommended Operating Conditions
    4. Table 3. Thermal Information
    5. Table 4. Electrical Characteristics
    6. Table 5. Timing Requirements
    7. 7.2      Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  UART Modes
      2. 9.3.2  Trigger Levels
      3. 9.3.3  Hardware Flow Control
      4. 9.3.4  Auto-RTS
      5. 9.3.5  Auto-CTS
      6. 9.3.6  Software Flow Control
      7. 9.3.7  Software Flow Control Example
      8. 9.3.8  Reset
      9. 9.3.9  Interrupts
      10. 9.3.10 Interrupt Mode Operation
      11. 9.3.11 Polled Mode Operation
      12. 9.3.12 Break and Timeout Conditions
      13. 9.3.13 Programmable Baud Rate Generator with Fractional Divisor
      14. 9.3.14 Fractional Divisor
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Interface Mode
        1. 9.4.1.1 IOR Used (MODE = VCC)
        2. 9.4.1.2 IOR Unused (MODE = GND)
      2. 9.4.2 DMA Signaling
        1. 9.4.2.1 Single DMA Transfers (DMA Mode 0 or FIFO Disable)
        2. 9.4.2.2 Block DMA Transfers (DMA Mode 1)
      3. 9.4.3 Sleep Mode
    5. 9.5 Register Maps
      1. 9.5.1  Registers Operations
      2. 9.5.2  Receiver Holding Register (RHR)
      3. 9.5.3  Transmit Holding Register (THR)
      4. 9.5.4  FIFO Control Register (FCR)
      5. 9.5.5  Line Control Register (LCR)
      6. 9.5.6  Line Status Register (LSR)
      7. 9.5.7  Modem Control Register (MCR)
      8. 9.5.8  Modem Status Register (MSR)
      9. 9.5.9  Interrupt Enable Register (IER)
      10. 9.5.10 Interrupt Identification Register (IIR)
      11. 9.5.11 Enhanced Feature Register (EFR)
      12. 9.5.12 Divisor Latches (DLL, DLH, DLF)
      13. 9.5.13 Transmission Control Register (TCR)
      14. 9.5.14 Trigger Level Register (TLR)
      15. 9.5.15 FIFO Ready Register
      16. 9.5.16 Alternate Function Register (AFR)
      17. 9.5.17 RS-485 Mode
      18. 9.5.18 IrDA Overview
      19. 9.5.19 IrDA Encoder Function
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Set the desired baud rate
        2. 10.2.2.2 Reset the fifos
        3. 10.2.2.3 Sending data on the bus
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Table 4. Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 1.8 V
VOH High-level output voltage IOH = –0.5 mA 1.3 V
VOL Low-level output voltage IOL = 1 mA 0.5
II Input current VCC = 1.98 V,
VI = 0 to 1.98 V		 VSS = 0,
All other terminals floating		 10 μA
IOZ High-impedance state
output current		 VCC = 1.98 V,
VO = 0 to 1.98 V		 Chip selected in write mode or chip deselect ±20 μA
ICC Supply current VCC = 1.98 V, DSR, CTS, and RI at 2 V All other inputs at 0.4 V,
No load on outputs, XTAL1 at 16 MHz,
Baud rate = 1 Mb/s		 6 mA
CI(CLK) Clock input capacitance VCC = 0,
f = 1 MHz,
All other terminals grounded		 VSS = 0,
TA = 25°C,		 5 7 pF
CO(CLK) Clock output capacitance 5 7
CI Input capacitance 6 10
CO Output capacitance 10 15
VCC = 2.5 V
VOH High-level output voltage IOH = –1 mA 1.8 V
VOL Low-level output voltage IOL = 2 mA 0.5
II Input current VCC = 2.75 V,
VI = 0 to 2.75 V		 VSS = 0,
All other terminals floating		 10 μA
IOZ High-impedance state output current VCC = 2.75 V,
VO = 0 to 2.75 V		 Chip selected in write mode or chip deselect ±20 μA
ICC Supply current VCC = 2.75 V, DCD, CTS, and RI at 2 V All other inputs at 0.6 V,
No load on outputs, XTAL1 at 24 MHz,
Baud rate = 1.5 Mb/s		 13 mA
CI(CLK) Clock input capacitance VCC = 0,
f = 1 MHz,
All other terminals grounded		 VSS = 0,
TA = 25°C,		 5 7 pF
CO(CLK) Clock output capacitance 5 7
CI Input capacitance 6 10
CO Output capacitance 10 15
VCC = 3.3 V
VOH High-level output voltage IOH = –1.8 mA 2.4 V
VOL Low-level output voltage IOL = 3.2 mA 0.5
II Input current VCC = 3.6 V,
VI = 0 to 3.6 V		 VSS = 0,
All other terminals floating		 10 μA
IOZ High-impedance state
output current		 VCC = 3.6 V,
VO = 0 to 3.6 V		 Chip selected in write mode or chip deselect ±20 μA
ICC Supply current VCC = 3.6 V, DSR, CTS, and RI at 2 V All other inputs at 0.8 V,
No load on outputs, XTAL1 at 32 MHz,
Baud rate = 2 Mb/s		 25 mA
CI(CLK) Clock input capacitance VCC = 0,
f = 1 MHz,
All other terminals grounded		 VSS = 0,
TA = 25°C,		 5 7 pF
CO(CLK) Clock output capacitance 5 7
CI Input capacitance 6 10
CO Output capacitance 10 15
VCC = 5 V
VOH High-level output voltage IOH = –4 mA 4 V
VOL Low-level output voltage IOL = 4 mA 0.5
II Input current VCC = 5.5 V,
VI = 0 to 5.5 V		 VSS = 0,
All other terminals floating		 10 μA
IOZ High-impedance state
output current		 VCC = 5.5 V,
VO = 0 to 5.5 V		 Chip selected in write mode or chip deselect ±20 μA
ICC Supply current VCC = 5.5 V, DSR, CTS, and RI at 2 V All other inputs at 0.8 V,
No load on outputs, XTAL1 at 48 MHz,
Baud rate = 3 Mb/s		 60 mA
CI(CLK) Clock input capacitance VCC = 0,
f = 1 MHz,
All other terminals grounded		 VSS = 0,
TA = 25°C,		 5 7 pF
CO(CLK) Clock output capacitance 5 7
CI Input capacitance 6 10
CO Output capacitance 10 15
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