ZHCSX73C August   2006  – October 2024

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Reference Section Electrical Characteristics
    6. 5.6  Oscillator Section Electrical Characteristics
    7. 5.7  Error-Amplifier Section Electrical Characteristics
    8. 5.8  Current-Sense Section Electrical Characteristics
    9. 5.9  Output Section Electrical Characteristics
    10. 5.10 Undervoltage-Lockout Section Electrical Characteristics
    11. 5.11 Pulse-Width Modulator Section Electrical Characteristics
    12. 5.12 Supply Voltage Electrical Characteristics
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Shutdown Technique
    3. 7.3 Open-Loop Laboratory Test Fixture
    4. 7.4 Typical Application
      1. 7.4.1 Application Curves
  9. 8 Device and Documentation Support
    1. 8.1 Related Links
    2. 8.2 Trademarks
    3. 8.3 静电放电警告
    4. 8.4 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)TLx84xBUNIT
DPD
8 PINS8 PINS14 PINS
RθJAJunction-to-ambient thermal resistance117.474.187.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
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